Nanoimprint lithography processes for switching mechanical properties of imprint materials

Abstract

A method is described for modifying the mechanical properties of NIL materials. The method includes applying an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, with the NIL material layer comprised of a NIL material. The method further includes detaching the imprinted NIL material layer from the imprint mask, with the modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment. The modulus level of the NIL material of the imprinted NIL material layer is increased beyond a strength threshold to create a first imprint layer, with the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern.

What is claimed is: 
     
         1 . A method, comprising:
 applying an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, the NIL material layer comprised of a NIL material;   detaching the imprinted NIL material layer from the imprint mask, a modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment; and   increasing the modulus level of the NIL material of the imprinted NIL material layer beyond a strength threshold to create an imprint layer, the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern.   
     
     
         2 . The method of  claim 1 , wherein the NIL material layer has one or more first reacted functional groups, and increasing the modulus level of the NIL material further comprises:
 curing the imprinted NIL material layer to cause reaction in one or more second functional groups of the NIL material of the imprinted NIL material layer.   
     
     
         3 . The method of  claim 2 , wherein the curing of the imprinted NIL material layer comprises curing the imprinted NIL material layer using ultraviolet (UV) light radiation. 
     
     
         4 . The method of  claim 2 , wherein the curing of the imprinted NIL material layer comprises curing the imprinted NIL material layer using thermal energy. 
     
     
         5 . The method of  claim 1 , wherein increasing the modulus level of the NIL material further comprises:
 applying an overcoat layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition, the overcoat layer having a modulus level beyond the strength threshold.   
     
     
         6 . The method of  claim 5 , wherein the inorganic material is at least one of Al 2 O 3 , AlN, and Er 2 O 3 . 
     
     
         7 . The method of  claim 1 , wherein increasing the modulus level of the NIL material further comprises:
 applying a layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition; and   causing the layer of inorganic material to reactively infuse into the imprinted NIL material layer, wherein a combined NIL material and infusion material has a modulus level beyond the strength threshold.   
     
     
         8 . A nano-imprint lithography (NIL) modification system, comprising:
 a NIL imprinting system configured to apply an imprint mask to a NIL material layer;   a NIL material modification system configured to modify a modulus level of NIL material;   a NIL post-processing system configured to perform post-processing operations on an imprint layer; and   a controller to transmit instructions to the NIL modification system configured to:
 apply an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, the NIL material layer comprised of a NIL material, 
 detach the imprinted NIL material layer from the imprint mask, the modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment, and 
 increase the modulus level of the NIL material of the imprinted NIL material layer beyond a strength threshold to create a first imprint layer, the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern. 
   
     
     
         9 . The system of  claim 8 , wherein the NIL material layer has one or more first reacted functional groups reacted, and wherein further transmitted instructions from the controller cause the NIL modification system to:
 cure the imprinted NIL material layer to cause reaction in one or more second functional groups of the NIL material of the imprinted NIL material layer.   
     
     
         10 . The system of  claim 9 , wherein the cure of the imprinted NIL material layer uses ultraviolet (UV) light radiation. 
     
     
         11 . The system of  claim 9 , wherein the curing of the imprinted NIL material layer uses thermal energy. 
     
     
         12 . The system of  claim 8 , wherein further transmitted instructions from the controller cause the NIL modification system to
 apply an overcoat layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition, the overcoat layer having a modulus level beyond the strength threshold.   
     
     
         13 . The system of  claim 12 , wherein the inorganic material is at least one of Al 2 O 3 , AlN, and Er 2 O 3 . 
     
     
         14 . The method of  claim 8 , wherein further transmitted instructions from the controller cause the NIL modification system to:
 apply a layer of inorganic material to a surface of the imprinted NIL material layer using atomic layer deposition; and   cause the layer of inorganic material to reactively infuse into the imprinted NIL material layer, wherein a combined NIL material and infusion material has a modulus level beyond the strength threshold.   
     
     
         15 . The system of  claim 8 , wherein the imprinted NIL material layer has a plasticizer previously infused within the NIL material of the imprinted NIL material layer, and wherein further transmitted instructions from the controller cause the NIL modification system to:
 remove the plasticizer from the NIL material of the imprinted NIL material layer.   
     
     
         16 . The system of  claim 15 , wherein the removal of the plasticizer is achieved by increasing a temperature and decreasing a pressure of a chamber containing the imprinted NIL material layer. 
     
     
         17 . An imprint layer manufactured by:
 applying an imprint mask to a nano-imprint lithography (NIL) material layer to create an imprinted NIL material layer, the NIL material layer comprised of a NIL material;   detaching the imprinted NIL material layer from the imprint mask, a modulus level of the NIL material below a flexibility threshold to cause a shape of the imprinted NIL material layer to remain unchanged after detachment; and   increasing the modulus level of the NIL material of the imprinted NIL material layer beyond a strength threshold to create an imprint layer, the imprint layer having a structure that remains unaffected by a subsequent process to form a second imprint layer matching a master mold pattern.