US2022128633A1PendingUtilityA1

Sensor Device

Assignee: TDK MICRONAS GMBHPriority: Jan 25, 2019Filed: Jan 12, 2022Published: Apr 28, 2022
Est. expiryJan 25, 2039(~12.5 yrs left)· nominal 20-yr term from priority
Inventors:Jörg Franke
G01R 33/0017G01R 33/0005G01R 35/00G01R 33/0035H01F 5/04H01F 2017/0073H01F 5/003G01R 33/09G01R 33/07G01R 33/0094G01D 5/145G01R 33/0011
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Claims

Abstract

A sensor device ( 10 ) is described. The sensor device ( 10 ) comprises a laterally arranged double coil ( 20 ) with a first coil ( 30 a ) and a second coil ( 30 b ), wherein first windings ( 40 a ) of the first coil ( 30 a ) and second windings ( 40 b ) of the second coil ( 40 b ) are arranged in a spiral shape. The first windings ( 40 a ) from a first center point ( 50 a ) lead to a common region ( 60 ) and the second windings ( 40 b ) from a second center point ( 50 b ) lead to the common region ( 60 ) as well. A plurality of magnetic field sensor ( 70, 72 a, 72 b ) is disposed on the laterally arranged double coil ( 20 ), wherein the plurality of magnetic field sensors are an interconnection of a plurality of individual sensors, and wherein the plurality of magnetic field sensors are at least four TMR elements in a Wheatstone Bridge or four Hall elements connected in parallel

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A sensor device comprising:
 a laterally arranged double coil with a first coil and a second coil, wherein first windings of the first coil and second windings of the second coil are arranged in a spiral shape and wherein the first windings lead from a first center point to a common region and the second windings lead from a second center point to the common region; and   a plurality of magnetic field sensors disposed on the laterally arranged double coil, wherein the plurality of magnetic field sensors are an interconnection of a plurality of individual sensors, and wherein the plurality of individual sensors are at least four TMR elements in a Wheatstone Bridge or four Hall elements connected in parallel.   
     
     
         2 . The sensor device according to  claim 1 , wherein the plurality of magnetic field sensor are applied to a chip. 
     
     
         3 . The sensor device according to  claim 1 , wherein the plurality of magnetic-field sensor are disposed on the double coil. 
     
     
         4 . The sensor device according to  claim 1 , wherein the first windings of the first coil are executed in a same winding direction as the second windings of the second coil. 
     
     
         5 . The sensor device according to  claim 1 , wherein at least one of the plurality of magnetic field sensors is located in the common region. 
     
     
         6 . The sensor device according to  claim 1 , wherein the plurality of magnetic field sensors are at least one of a Hall sensor, a flux gate or an MR sensor. 
     
     
         7 . The sensor device according to  claim 1 , wherein the first center point and the second center point are electrically connected to connectors via bond wires. 
     
     
         8 . The sensor device according to  claim 1 , wherein the first windings of the first coil are executed in the direction contrary to the second windings of the second coil.

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