Ceramic substrate and electronic component-embedded module

Abstract

A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

1 . A ceramic substrate comprising a ceramic body having a ceramic layer on a surface thereof; and a surface electrode on a primary face of the ceramic body, wherein:
 the ceramic substrate further comprises an oxide layer provided between the surface electrode and the ceramic layer,   wherein the oxide layer includes an insulating oxide having a melting point higher than a firing temperature for the ceramic layer; and   a surface of the ceramic layer not occupied by the surface electrode is exposed.   
     
     
         2 . The ceramic substrate according to  claim 1 , wherein the oxide layer is an alumina layer. 
     
     
         3 . An electronic component-embedded module comprising:
 the ceramic substrate according to  claim 1 ;   an electronic component mounted on the surface electrode of the ceramic substrate; and   a sealing resin placed on the primary face of the ceramic substrate to cover the electronic component.