Resin composition, cured product, sheet-like laminate material, resin sheet, printed wiring board, and semiconductor device

Abstract

Resin compositions including: (A) a naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and (B) a curing agent, in which (B) the curing agent includes an active ester type curing agent are useful for preparing cured products, sheet lamination materials, resin sheets, printed wiring boards, and semiconductor devices, and for methods for producing printed wiring boards or semiconductor devices.

What is claimed is: 
     
         1 . A resin composition, comprising
 (A) at least one naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and   (B) at least one curing agent,   
       wherein (B) said curing agent comprises (B-1) an active ester type curing agent. 
     
     
         2 . The resin composition according to  claim 1 , wherein
 said component (A) comprises a compound represented by formula (A1):   
       
         
           
           
               
               
           
         
       
       wherein:
 Ar1 is an optionally substituted arylene group having 6 to 20 carbon atoms; 
 each Ra independently represents a hydrogen atom, a monovalent group having an epoxy group, or an alkyl group having 1 to 12 carbon atoms, in which at least one Ra is the monovalent group having an epoxy group, and at least one Ra is the alkyl group having 1 to 12 carbon atoms; 
 Rb and Rc each independently represent a monovalent group having an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; 
 Rd represents a hydrogen atom, a monovalent group having an epoxy group, an alkyl group having 1 to 12 carbon atoms, an allyl group, or an aryl group having 6 to 10 carbon atoms; 
 each R1 independently represents a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; 
 n represents an integer of 2 to 50; 
 mb represents an integer of 0 to 6; and 
 mc represents an integer of 0 to 5. 
 
     
     
         3 . The resin composition according to  claim 2 , wherein
 said component (A) comprises a compound represented by formula (A2):   
       
         
           
           
               
               
           
         
       
       wherein Ra and n are the same as Ra and n, respectively, in formula (A1). 
     
     
         4 . The resin composition according to  claim 2 , wherein n is 4 or more, and at least two Ra are an alkyl group having 1 to 6 carbon atoms. 
     
     
         5 . The resin composition according to  claim 1 , wherein said component (B) further comprises (B-2) a curing agent other than the active ester type curing agent. 
     
     
         6 . The resin composition according to  claim 5 , wherein said component (B-2) is present in an amount which is less than that of said component (B-1). 
     
     
         7 . The resin composition according to  claim 1 , wherein said component (B-1) is present in an amount of 3 to 50% by mass relative to 100% by mass of nonvolatile components in said resin composition. 
     
     
         8 . The resin composition according to  claim 1 , wherein said component (A) is present in an amount of 5 to 70% by mass relative to 100% by mass of nonvolatile components in said resin composition. 
     
     
         9 . The resin composition according to  claim 1 , wherein said component (B) is present in an amount of 3 to 70% by mass relative to 100% by mass of nonvolatile components in said resin composition. 
     
     
         10 . The resin composition according to  claim 1 , wherein said resin composition further comprises:
 (C) at least one inorganic filler.   
     
     
         11 . The resin composition according to  claim 10 , wherein said component (C) is present in an amount of 40% or more by mass relative to 100% by mass of nonvolatile components in the resin composition. 
     
     
         12 . The resin composition according to  claim 1 , wherein a glass transition temperature of a cured product thereof is higher than 145° C. 
     
     
         13 . The resin composition according to  claim 1 , wherein a dielectric loss tangent of a cured product thereof is less than 0.005. 
     
     
         14 . A cured product of a resin composition according to  claim 1 . 
     
     
         15 . The cured product according to  claim 14 , which has a glass transition temperature higher than 145° C. 
     
     
         16 . The cured product according to  claim 14 , which has a dielectric loss tangent less than 0.005. 
     
     
         17 . A sheet lamination material, comprising a resin composition according to  claim 1 . 
     
     
         18 . A resin sheet, comprising:
 a supporting body; and   a resin composition layer formed on said supporting body, said resin composition layer comprising a resin composition according to  claim 1 .   
     
     
         19 . A printed wiring board, comprising an insulating layer formed of a cured product of a resin composition according to  claim 1 . 
     
     
         20 . A semiconductor device, comprising the printed wiring board according to  claim 19 . 
     
     
         21 . A method for producing a printed wiring board, comprising a step of forming an insulating layer of the printed wiring board by using a resin composition according to  claim 1 .