Method for obtaining electronic devices and electronic devices

Abstract

The invention refers to electronic devices (D) and to a method for obtaining electronic devices (D) comprising, electronic elements, in particular optoelectronic elements (7), the method comprising the steps of:—providing (S1) a substrate from which first walls (1) protrude along a Z-axis towards an open end side forming at least one rectangle along a X-Y-plane surrounding a respective at least one space(S);—positioning (S2) a respective electronic element (7a), in particular optoelectronic element (7),within the respective space(S)and connecting it to contact pads (9);—attaching (S3) a respective functional element (11a), in particular optical element (11), in particular a lens, at the open end side of respective first wall (1) to cover the respective space (S);—forming a second wall (2) by surrounding (S4) the respective functional element (11a), in particular optical element (11), with a darn material.

1 . A method for obtaining at least one optoelectronic device each comprising an optoelectronic element, wherein the optoelectronic element comprises at least one of a LED, a LASER, a VCSEL, comprising the steps of:
 providing a substrate from which a first wall protrude along a Z-axis towards an open end side forming at least one rectangle along a X-Y-plane surrounding at least one space;   positioning the optoelectronic element within the at least one space and connecting the optoelectronic element to contact pads;   arranging a respective optical element, in particular a lens, at the open end side of the first wall to cover the at least one space; and   forming a second wall by surrounding the respective optical element along a the X-Y-plane with a dam material;
 wherein providing a substrate comprises forming the first wall, and forming the first wall comprises forming an open end side of the first wall as a flat area; and 
 whereby the optical element is attached flush with the first wall and the second wall is formed perpendicular to the substrate by completely surrounding the optical element and the first wall along the X-Y plane forming rectangles. 
   
     
     
         2 . The method according to  claim 1 ,
 characterized by   the substrate is a Quad-Flat-No-Leads-QFN leadframe.   
     
     
         3 . The method according to  claim 2 ,
 characterized by   the step of providing a substrate comprises pre-molding of the leadframe.   
     
     
         4 . The method according to  claim 3 ,
 characterized by   etching the leadframe on both sides.   
     
     
         5 . The method according to  claim 1 ,
 characterized by   the dam material is a thixotropic material, in particular a high thixotropic material, in particular silicone and/or epoxy.   
     
     
         6 . The method according to  claim 1 ,
 characterized by   the step of forming a second wall comprises at least one of casting, jetting or molding, compression molding, transfer molding or film assisted molding of the dam material.   
     
     
         7 . The method according to  claim 1 ,
 characterized by   the step of forming a first wall comprises forming a recess along the first wall's open end side.   
     
     
         8 . The method according to  claim 7 ,
 characterized by   before the step of forming a recess the open end side of a first wall was formed as a flat area.   
     
     
         9 . The method according to  claim 1 ,
 characterized by   the step of forming a first wall comprises forming a rising along the first wall's open end side.   
     
     
         10 . The method according to  claim 1 ,
 characterized by   the step of forming a second wall comprises filling of the dam material into gaps between adjacent positioned optical elements, recesses and/or risings.   
     
     
         11 . The method according to  claim 10 ,
 characterized by   the step of forming a second wall comprises forming of additional structures of the dam material onto a surface of an optical element surface that is averted to the substrate.   
     
     
         12 . (canceled) 
     
     
         13 . The method according to  claim 1 ,
 characterized by   the second wall is formed in between the optical element, the first wall and a completely surrounding third wall, in particular being pre-molded on the substrate.   
     
     
         14 . Method The method according to  claim 1 ,
 wherein   first walls of several optoelectronic devices comprise equal thicknesses and rectangles comprise equal sizes.   
     
     
         15 . The method according to  claim 1 ,
 characterized by   the optoelectronic element is a die.   
     
     
         16 . The method according to  claim 1 ,
 characterized by   connecting the optoelectronic elements by wire bonding to contact pads.   
     
     
         17 . The method according to  claim 1 ,
 characterized by   the optoelectronic element is a meta-lens or a diffractive optical element or a micro lens array or a TIR lens.   
     
     
         18 . Method according to anyone of the preceding claims,
 characterized by   dam material comprises an adhesive, in particular Epoxy or silicone.   
     
     
         19 . The method according to  claim 1 ,
 further comprising separating optoelectronic devices out of a row or out of an array of optoelectronic devices.   
     
     
         20 . The method according to  claim 18 ,
 characterized by   the step of separating comprise sawing.   
     
     
         21 . An optoelectronic device comprising:
 a substrate from which a first wall protrudes along a Z-axis towards an open end side forming at least one rectangle along a X-Y-plane surrounding at least one space and the first wall forming the open end side of the first wall as a flat area;   an optoelectronic element, within the at lease one space being connected to contact pads;   an optical element, in particular a lens, at the open end side of the first wall covering the at least one space;   the optical element being surrounded along the X-Y-plane with a dam material forming a second wall,   whereby the optical element is attached flush with the first wall, and the second wall is formed perpendicular to the substrate completely surrounding the optical element and the first wall along the X-Y- plane forming rectangles.   
     
     
         22 . The optoelectronic device according to  claim 21 ,
 characterized by   the optoelectronic element comprises an emitter, and is in particular a LED, a LASER, a VCSEL.   
     
     
         23 . The optoelectronic device according to  claim 21 ,
 characterized by   the optoelectronic element comprises a detector or sensor.   
     
     
         24 . (canceled) 
     
     
         25 . (canceled)