ELECTROLESS Ni-Fe ALLOY PLATING SOLUTION

Abstract

An object of the present invention is to provide an electroless Ni—Fe alloy plating solution with which continuous plating can be carried out in a stable manner. An electroless Ni—Fe alloy plating solution comprising a nickel ion source, an iron ion source, a complexing agent and a reducing agent, wherein the iron ion source is a ferric ion source is provided. It is preferable that the ferric ion source is one or two or more iron salts selected from the group consisting of iron (III) sulfate, iron (III) chloride, iron alum, iron (III) oxide and iron (III) hydroxide. It is preferable that the content of the ferric ion is 0.001 to 1.0 mol/L at the time of the initial make-up of plating bath. It is preferable that the content of the ferrous ion is 0.1 mol/L or less at the time of the initial make-up of plating bath.

1 . An electroless Ni—Fe alloy plating solution, comprising a nickel ion source, an iron ion source, a complexing agent and a reducing agent, wherein the iron ion source is a ferric ion source. 
     
     
         2 . The electroless Ni—Fe alloy plating solution according to  claim 1 , wherein the ferric ion source is one or two or more iron salts selected from the group consisting of iron (III) sulfate, iron (III) chloride, iron alum, iron (III) oxide and iron (III) hydroxide. 
     
     
         3 . The electroless Ni—Fe alloy plating solution according to  claim 1 , wherein the content of the ferric ion in the electroless Ni—Fe alloy plating solution is 0.001 to 1.0 mol/L at the time of initial make-up of plating bath. 
     
     
         4 . The electroless Ni—Fe alloy plating solution according to  claim 1 , wherein the content of the ferrous ion at the electroless Ni—Fe alloy plating solution is 0.1 mol/L or less at the time of initial make-up of plating bath. 
     
     
         5 . The electroless Ni—Fe alloy plating solution according to  claim 1 , wherein the nickel ion source is one or two or more nickel salts selected from the group consisting of nickel chloride, nickel sulfate, nickel sulfamate, nickel hypophosphite, nickel citrate, nickel carbonate and nickel acetate. 
     
     
         6 . The electroless Ni—Fe alloy plating solution according to  claim 1 , wherein the complexing agent is one or two or more complexing agents selected from the group consisting of tartaric acid, citric acid, gluconic acid, pyrophosphoric acid, etidronic acid, alanine, glycine, glutamic acid, hydantoin, arginine, acetic acid, succinic acid, ascorbic acid, butyric acid, fumaric acid, pyruvic acid, lactic acid, malic acid, oxalic acid, ammonia, monoethanolamine, triethylenetetramine, triethanolamine, ethylenediamine, ethylenediaminetetraacetic acid and a salt thereof. 
     
     
         7 . The electroless Ni—Fe alloy plating solution according to  claim 1 , wherein the reducing agent is one or two or more reducing agents selected from the group consisting of hypophosphorous acid, hypophosphite, dimethylamineborane, titanium (III) and hydrazine.