Deep molded reflector cup used as complete led package

Abstract

A light emitting device is disclosed. The light emitting device comprises a metal lead frame including a first lead and a second lead. The light emitting device comprises a first bonding pad on the first lead. The light emitting device comprises a second bonding pad on the second lead. The light emitting device comprises a structure molded on the first lead and the second lead. The structure includes walls extending from a first area of the structure proximate to the metal lead frame. The light emitting device comprises a light emitting diode (LED) die disposed on the first area of the structure. The LED die includes a first electrode electrically coupled to the first bonding pad and a second electrode electrically coupled to the second bonding pad. The light emitting device comprises an encapsulant partially filling the structure.

What is claimed is: 
     
         1 . A light emitting device comprising:
 a metal lead frame including a first lead and a second lead;   a first bonding pad on the first lead;   a second bonding pad on the second lead;   a structure molded on the first lead and the second lead, the structure including walls extending from a first area of the structure proximate to the metal lead frame;   a light emitting diode (LED) die disposed on the first area of the structure, the LED die including a first electrode electrically coupled to the first bonding pad and a second electrode electrically coupled to the second bonding pad; and   an encapsulant partially filling the structure.   
     
     
         2 . The light emitting device of  claim 1 , wherein the first lead and the second lead extend beyond lateral sides of the LED. 
     
     
         3 . The light emitting device of  claim 1 , wherein the structure comprises plastic containing metal particles. 
     
     
         4 . The light emitting device of  claim 1 , wherein the structure is at least 5 mm deep. 
     
     
         5 . The light emitting device of  claim 1 , wherein the structure comprises a top opening that is at least three times as large as a bottom area. 
     
     
         6 . The light emitting device of  claim 1 , wherein the structure is shaped as a compound parabolic concentrator. 
     
     
         7 . The light emitting device of  claim 1  further comprising a reflective material disposed on the walls of the structure. 
     
     
         8 . The light emitting device of  claim 1  further comprising a dichroic coating disposed on the walls of the structure. 
     
     
         9 . The light emitting device of  claim 1 , wherein the encapsulant forms a planar surface that meets with the walls of the structure and is situated below a top edge of the structure. 
     
     
         10 . The light emitting device of  claim 9 , wherein the encapsulant forms sidewalls along the walls of the structure such that the sidewalls extend contiguously from the first area of the structure to the planar surface. 
     
     
         11 . A method of forming a light emitting device comprising:
 forming a metal lead frame including a first lead and a second lead;   forming a first bonding pad on the first lead;   forming a second bonding pad on the second lead;   molding a first material over the first lead and the second lead to form a molded structure, the structure including walls extending from a first area of the structure proximate to the metal lead frame;   mounting a light emitting diode (LED) die on the first area of the structure;   electrically connecting a first electrode of the LED die to the first bonding pad and a second electrode to the second bonding pad; and   partially filling the structure with an encapsulant.   
     
     
         12 . The method of  claim 11 , wherein the first lead and the second lead extend beyond lateral sides of the LED. 
     
     
         13 . The method of  claim 11 , wherein the structure comprises plastic containing metal particles. 
     
     
         14 . The method of  claim 11 , wherein the structure is at least 5 mm deep. 
     
     
         15 . The method of  claim 11 , wherein the structure comprises a top opening that is at least three times as large as a bottom area. 
     
     
         16 . The method of  claim 11 , wherein the structure is shaped as a compound parabolic concentrator. 
     
     
         17 . The method of  claim 11  further comprising disposing a reflective material on the walls of the structure. 
     
     
         18 . The method of  claim 11  further comprising disposing a dichroic coating on the walls of the structure. 
     
     
         19 . The method of  claim 11 , wherein the encapsulant forms a planar surface that meets with the walls of the structure and is situated below a top edge of the structure. 
     
     
         20 . The method of  claim 19 , wherein the encapsulant forms sidewalls along the walls of the structure such that the sidewalls extend contiguously from the first area of the structure to the planar surface.