Electronic component package including stacked shield layers

Abstract

The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.

1 . An electronic component package comprising:
 an electronic component mounted on a circuit board having a ground pattern;   a mold containing an epoxy resin that encapsulates the electronic component;   a polymer layer formed on a surface of the mold; and   a shield layer formed on the polymer layer, the shield layer comprising a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the polymer layer,   wherein the shield layer is grounded to the ground pattern,   wherein metal particles in the metal particle layer are coated with a polymer dispersant having a functional group coordinates to the metal particles.   
     
     
         2 . The electronic component package according to  claim 1 , wherein the polymer dispersant has a reactive functional group [Y], and the polymer layer is a layer containing a polymer having a reactive functional group [X], wherein the reactive functional group [Y] and the reactive functional group [X] form a chemical bond. 
     
     
         3 . The electronic component package according to  claim 2 , wherein the reactive functional group [Y] is a basic nitrogen atom-containing group. 
     
     
         4 . The electronic component package according to  claim 2 , wherein the polymer having the reactive functional group [Y] is at least one selected from the group consisting of a polyalkyleneimine and a polyalkyleneimine having a polyoxyalkylene structure including an oxyethylene unit. 
     
     
         5 . The electronic component package according to  claim 2 , wherein the reactive functional group [X] is at least one selected from the group consisting of a keto group, an acetoacetyl group, an epoxy group, a carboxyl group, an N-alkylol group, an isocyanate group, a vinyl group, a (meth)acryloyl group, and an allyl group. 
     
     
         6 . The electronic component package according to  claim 1 , wherein the metal particle layer comprises 80-99.9% by mass of metal particles and 0.1 to 20% by mass of the polymer dispersant. 
     
     
         7 . The electronic component package according to  claim 1 , wherein the metal particle layer consists of 80-99.9% by mass of metal particles and 0.1 to 20% by mass of the polymer dispersant.