Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device

Abstract

A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal body formed on the resin layer, the method including the steps of: (A) providing a magnetic metal body having at least one first opening; (B) providing a substrate; (C) forming a resin layer by applying a solution including a resin material or a varnish of a resin material on a surface of a substrate, and then performing a heat treatment thereon; (D) securing the resin layer formed on the substrate on the magnetic metal body so as to cover the at least one first opening; (E) forming a plurality of second openings in a region of the resin layer that is located in the at least one first opening of the magnetic metal body; and (F) after the step (E), removing the substrate from the resin layer.

1 . A vapor deposition mask comprising:
 a frame;   a magnetic metal body supported on the frame and including at least one first opening;   a resin layer arranged on the magnetic metal body so as to cover the at least one first opening; and   an adhesive layer located between the resin layer and the magnetic metal body for attaching together the resin layer and the magnetic metal body, wherein:   the resin layer has a tensile stress in a layer in-plane direction; and   the magnetic metal body receives a compressive stress in an in-plane direction from the resin layer.   
     
     
         2 . The vapor deposition mask according to  claim 1 , wherein the tensile stress of the resin layer is greater than 0.2 MPa at room temperature. 
     
     
         3 . The vapor deposition mask according to  claim 1 , wherein there is no magnetic metal on a region of the resin layer that is located in the at least one first opening of the magnetic metal body. 
     
     
         4 . The vapor deposition mask according to  claim 1 , wherein:
 the adhesive layer is a metal layer that is a plating layer fixed on the resin layer, and   the metal layer is not present on a region of the resin layer that is located in the at least one first opening of the magnetic metal body.   
     
     
         5 . The vapor deposition mask according to  claim 1 , wherein:
 the resin layer is produced by forming a resin film having a tensile stress of greater than 0.2 MPa at room temperature in a substrate, and then securing the resin film onto the magnetic metal body, followed by removing the substrate from the resin film, and   the resin layer and the magnetic metal body is secured on the frame while a step of stretching the resin layer and the magnetic metal body in a predetermined layer in-plane direction is not performed.