Focused sterilization and sterilized sub-assemblies for analyte monitoring systems

Abstract

A system includes a sensor applicator, a sensor control device arranged within the sensor applicator and including an electronics housing and a sensor extending from a bottom of the electronics housing, and a cap coupled to one of the sensor applicator and the sensor control device, wherein the cap is removable prior to deploying the sensor control device from the sensor applicator.

What is claimed is: 
     
         1 . A method for assembling a system for measurement of a glucose level, comprising:
 providing a sensor control device including:
 an electronics housing comprising a shell having an upper surface with a first aperture defined in the upper surface at a first location and a depression defined in the upper surface at a second location spaced apart from the first location, the depression configured to facilitate control of the electronics housing in at least one degree of freedom, a mount mated to the shell and having an underside with a second aperture defined therein aligned with the first aperture, a circuit board disposed within the electronics housing and having a plurality of electronic modules, a glucose sensor coupled with the circuit board and configured to measure a glucose level, a plurality of discrete grooves defined at an outer periphery of the mount, and an adhesive patch attached to the underside of the mount and configured to secure the sensor control device on a user's skin; and 
   controlling the electronics housing in at least one degree of freedom using the depression.   
     
     
         2 . The method of  claim 1 , wherein the electronics housing is controlled using the depression in at least one degree of freedom during assembly. 
     
     
         3 . The method of  claim 1 , wherein providing the sensor control device includes:
 providing the shell;   providing the mount; and   mating the shell to the mount to form the electronics housing.   
     
     
         4 . The method of  claim 3 , wherein providing the sensor control device further includes positioning the circuit board within the electronics housing. 
     
     
         5 . The method of  claim 4 , wherein providing the sensor control device further includes electrically coupling the glucose sensor to the circuit board. 
     
     
         6 . The method of  claim 1 , wherein providing the sensor control device further includes attaching the adhesive patch to the underside of the mount. 
     
     
         7 . The method of  claim 1 , further comprising loading the electronics housing into an applicator housing. 
     
     
         8 . The method of  claim 7 , further comprising coupling a distal end of an applicator cap to the applicator housing to form an assembled applicator. 
     
     
         9 . The method of  claim 1 , wherein the shell defines at least one of a chamfered or angled outer periphery. 
     
     
         10 . The method of  claim 1 , wherein the sensor control device further comprises a sharp extending through the first aperture and the second aperture, the sharp including a hollow portion configured to receive at least a portion of the glucose sensor. 
     
     
         11 . The method of  claim 1 , wherein the circuit board includes a third aperture aligned with the first aperture and the second aperture. 
     
     
         12 . The method of  claim 1 , further comprising an adhesive to secure the shell to the mount. 
     
     
         13 . The method of  claim 12 , wherein the adhesive isolates an interior of the electronics housing from outside contamination. 
     
     
         14 . The method of  claim 1 , wherein the shell is secured to the mount via snap fit engagement, an interference fit, sonic welding, ultrasonic welding, or mechanical fasteners. 
     
     
         15 . The method of  claim 1 , wherein the mount further comprises a plurality of module pockets to partially accommodate the plurality of electronics modules. 
     
     
         16 . The method of  claim 1 , wherein the plurality of discrete grooves are on the underside of the mount and extend into a sidewall of the mount. 
     
     
         17 . The method of  claim 16 , wherein the plurality of discrete grooves do not interconnect on the underside of the mount. 
     
     
         18 . The method of  claim 1 , wherein the plurality of discrete grooves are symmetrically arranged on the underside of the mount. 
     
     
         19 . The method of  claim 1 , wherein the underside of the mount comprises a receptacle with at least a portion of the glucose sensor received therein, and wherein the method comprises electronically coupling to the electronics housing in the receptacle. 
     
     
         20 . The method of  claim 19 , wherein the glucose sensor is electronically coupled to the electronics housing via circuitry contacts within the receptacle. 
     
     
         21 . The method of  claim 19 , further comprising a plug received with the receptacle. 
     
     
         22 . The method of  claim 21 , wherein the receptacle has a shape that matches a shape of the plug. 
     
     
         23 . A method for assembling a system for measurement of a glucose level, comprising:
 providing a shell having an upper surface with a first aperture defined in the upper surface at a first location and a depression defined in the upper surface at a second location spaced apart from the first location;   providing a mount having an underside with a second aperture defined therein aligned with the first aperture;   mating the shell to the mount to form an electronics housing;   positioning a circuit board within the electronics housing, the circuit board having a plurality of electronic modules;   electrically coupling a glucose sensor to the circuit board, the glucose sensor configured to generate a signal associated with a glucose level; and   controlling, using the depression, the electronics housing in at least one degree of freedom.   
     
     
         24 . The method of  claim 23 , wherein the electronics housing is controlled using the depression in at least one degree of freedom during assembly. 
     
     
         25 . The method of  claim 23 , wherein the underside of the mount comprises a receptacle with at least a portion of the glucose sensor received therein, and the method further comprising providing a plug within the receptacle. 
     
     
         26 . The method of  claim 23 , further comprising loading the electronics housing into an applicator housing. 
     
     
         27 . The method of  claim 26 , further comprising coupling a distal end of an applicator cap to the applicator housing to form an assembled applicator. 
     
     
         28 . The method of  claim 27 , further comprising applying a gas permeable layer over at least one vent at a proximal end of the applicator cap. 
     
     
         29 . The method of  claim 27 , further comprising subjecting the assembled applicator to gaseous chemical sterilization. 
     
     
         30 . The method of  claim 23 , further comprising attaching an adhesive patch to the underside of the mount.