Package-integrated bistable switch for electrostatic discharge (esd) protection

Abstract

A switch in a package substrate of a microelectronic package is provided, the switch comprising: an actuator plate; a strike plate; and a connecting element mechanically coupling the actuator plate and the strike plate. The switch is configured to move within a cavity inside the package substrate between an open position and a closed position, a conductive material is coupled to the switch and to a ground via in the package substrate, and the conductive material is configured to move with the switch, such that the switch is conductively coupled to the ground via in the open position and the closed position.

1 . A switch in a package substrate of a microelectronic package, the switch comprising:
 an actuator plate;   a strike plate; and   a connecting element mechanically coupled to the actuator plate and the strike plate,   wherein:
 the switch is configured to move within a cavity inside the package substrate, 
 a conductive material is coupled to the switch and to a ground via in the package substrate, 
 the switch is configured to move between an open position and a closed position, and 
 the conductive material is configured to move with the switch, such that the switch is conductively coupled to the ground via in the open position and the closed position. 
   
     
     
         2 . The switch of  claim 1 , wherein the conductive material is coupled to the strike plate. 
     
     
         3 . The switch of  claim 1 , wherein the conductive material is coupled to the connecting element. 
     
     
         4 . The switch of  claim 1 , wherein the package substrate comprises at least one conductive pathway coupled to a ground connection, the at least one conductive pathway including the ground via. 
     
     
         5 . The switch of  claim 1 , wherein the conductive material is flexible such that the conductive material bends when the switch moves from the open position to the closed position. 
     
     
         6 . The switch of  claim 1 , wherein the conductive material comprises relatively stiff elements coupled to at least one of the switch and the ground via with a flexible joint that enables the switch to be conductively coupled to the ground via in the open position and the closed position. 
     
     
         7 . The switch of  claim 1 , wherein:
 the strike plate is conductively coupled to a signal pathway in the closed position such that the signal pathway is conductively coupled to ground, and   the strike plate is conductively separated from the signal pathway in the open position.   
     
     
         8 . The switch of  claim 7 , wherein:
 the signal pathway comprises a signal via,   the strike plate comprises a through-hole surrounding the signal via, the through-hole having a larger diameter than the signal via,   in the closed position, the strike plate is in conductive contact with the signal via, and   in the open position, the strike plate is not in conductive contact with the signal via.   
     
     
         9 . The switch of  claim 1 , further comprising a first actuator and a second actuator, wherein:
 the first actuator is configured to move the actuator plate such that the switch is in the open position, and   the second actuator is configured to move the actuator plate such that the switch is in the closed position.   
     
     
         10 . A package substrate of a microelectronic package, the package substrate comprising:
 a cavity in a layer of the package substrate;   a switch configured to move within the cavity between an open position and a closed position;   a first actuator configured to move the switch to the open position; and   a second actuator configured to move the switch to the closed position,   wherein:
 the switch is in contact with a ground connection in the open position and the closed position, and 
 the switch is in contact with a signal connection in the closed position but not in the open position. 
   
     
     
         11 . The package substrate of  claim 10 , wherein:
 each of the first actuator and the second actuator comprises a first arm and a second arm,   the first arm is thicker than the second arm,   each of the first actuator and the second actuator is configured to bend towards the first arm when current is applied,   the second arm of the first actuator is closer to the signal connection than the first arm of the first actuator, and   the first arm of the second actuator is closer to the signal connection than the second arm of the second actuator.   
     
     
         12 . The package substrate of  claim 11 , wherein, in the open position:
 the first actuator is in contact with the switch,   the second actuator is not in contact with the switch, and   the first actuator is bent away from the signal connection.   
     
     
         13 . The package substrate of  claim 12 , wherein in the open position, current is configured to flow through the first actuator but not the second actuator. 
     
     
         14 . The package substrate of  claim 11 , wherein, in the closed position:
 the first actuator is not in contact with the switch,   the second actuator is in contact with the switch, and   the second actuator is bent toward from the signal connection.   
     
     
         15 . The package substrate of  claim 14 , wherein in the closed position, current is configured to flow through the second actuator but not the first actuator. 
     
     
         16 . The package substrate of  claim 10 , wherein the first actuator and the second actuator are not electrically coupled to the switch. 
     
     
         17 . A microelectronic package, comprising:
 a die; and   a package substrate coupled to the die on a first side, the package substrate comprising:
 a first interconnect on the first side electrically coupled to the die; 
 a second interconnect on a second side opposite to the first side; and 
 a switch located in a cavity of the package substrate between the first side and the second side, 
   wherein:
 the switch is electrically coupled to the second interconnect and a ground connection, 
 the switch is configured to move within the cavity between an open position and a closed position, 
 in the open position, there is a conductive pathway between the first interconnect and the second interconnect, and 
 in the closed position, there is a conductive pathway between the second interconnect and the ground connection. 
   
     
     
         18 . The microelectronic package of  claim 17 , wherein:
 the first interconnect and the second interconnect are coupled to a signal connection, and   in the closed position, the signal connection is conductively coupled to the ground connection.   
     
     
         19 . The microelectronic package of  claim 17 , wherein the package substrate further comprises an actuator configured to move the switch between the open position and the closed position. 
     
     
         20 . The microelectronic package of  claim 19 , wherein the actuator is configured to move the switch when a current is applied to the actuator.