Semiconductor device and method for manufacturing the same

Abstract

To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.

1 . (canceled) 
     
     
         2 . A semiconductor device comprising:
 a resin substrate;   a pixel portion including a thin film transistor over the resin substrate;   a driver circuit portion including a thin film transistor over the resin substrate; and   a first integrated circuit and a second integrated circuit provided on a different surface from each other,   wherein each of the first integrated circuit and the second integrated circuit has a region overlapping with the pixel portion.   
     
     
         3 . The semiconductor device according to  claim 2 , wherein the first integrated circuit includes a memory, and the second integrated circuit includes a CPU. 
     
     
         4 . The semiconductor device according to  claim 2 , wherein the first integrated circuit and the second integrated circuit overlap with each other. 
     
     
         5 . The semiconductor device according to  claim 2 , wherein the different surface is not a flexible printed circuit. 
     
     
         6 . The semiconductor device according to  claim 2 , wherein the semiconductor device is one selected from the group consisting of a personal computer, a player using a recording medium, a digital camera, a mobile phone, a portable book and a display unit. 
     
     
         7 . A semiconductor device comprising:
 a resin substrate;   a pixel portion including a thin film transistor over the resin substrate;   a driver circuit portion including a thin film transistor over the resin substrate; and   a first integrated circuit and a second integrated circuit provided on a different surface from each other,   wherein each of the first integrated circuit and the second integrated circuit has a region overlapping with the pixel portion, and   wherein the pixel portion emits light in an opposite direction to surfaces where the first integrated circuit and the second integrated circuit are provided.   
     
     
         8 . The semiconductor device according to  claim 7 , wherein the first integrated circuit includes a memory, and the second integrated circuit includes a CPU. 
     
     
         9 . The semiconductor device according to  claim 7 , wherein the first integrated circuit and the second integrated circuit overlap with each other. 
     
     
         10 . The semiconductor device according to  claim 7 , wherein the different surface is not a flexible printed circuit. 
     
     
         11 . The semiconductor device according to  claim 7 , wherein the semiconductor device is one selected from the group consisting of a personal computer, a player using a recording medium, a digital camera, a mobile phone, a portable book and a display unit.