Thermal Conducting Sheet, Method for Manufacturing Thermal Conducting Sheet, Heat Dissipation Member, and Semiconductor Device

Abstract

Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

1 . A thermal conducting sheet, comprising:
 a binder resin;   insulating-coated carbon fibers; and   a thermal conducting filler other than the insulating-coated carbon fibers,   wherein the insulating-coated carbon fibers comprise carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material, and   wherein the polymerizable material comprises a compound that comprises 2 or more radically polymerizable double bonds.   
     
     
         2 . (canceled) 
     
     
         3 . The thermal conducting sheet according to  claim 1 ,
 wherein an average thickness of the coating film observed when a cross-section of the coating film is observed with a TEM is between 100 nm and 1,000 nm.   
     
     
         4 . The thermal conducting sheet according to  claim 1 ,
 wherein a volume resistivity of the thermal conducting sheet at an applied voltage of 1,000 V is 1.0×10 10  Ω·cm or higher.   
     
     
         5 . The thermal conducting sheet according to  claim 1 ,
 wherein a compressibility of the thermal conducting sheet at a load of 0.5 kgf/cm 2  is 3% or higher.   
     
     
         6 . The thermal conducting sheet according to  claim 1 ,
 wherein the thermal conducting filler comprises at least any one selected from the group consisting of aluminum oxide, aluminum nitride, and zinc oxide.   
     
     
         7 . The thermal conducting sheet according to  claim 1 ,
 wherein the binder resin is a silicone resin.   
     
     
         8 . A method for producing a thermal conducting sheet, the method comprising:
 molding a thermal conducting resin composition that comprises a binder resin, insulating-coated carbon fibers, and a thermal conducting filler other than the insulating-coated carbon fibers into a predetermined shape and curing a resultant to obtain a molded body of the thermal conducting resin composition; and   cutting the molded body into a sheet shape to obtain a sheet of the molded body,   wherein the insulating-coated carbon fibers comprise carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material, and   wherein the polymerizable material comprises 2 or more radically polymerizable double bonds.   
     
     
         9 . (canceled) 
     
     
         10 . The method for producing a thermal conducting sheet according to  claim 8 , further comprising:
 applying an energy to a mixture obtained by mixing the polymerizable material, the carbon fibers, a polymerization initiator, and a solvent to activate the polymerization initiator to thereby form the coating film formed of the cured product of the polymerizable material over at least the part of the surface of the carbon fibers to obtain the insulating-coated carbon fibers.   
     
     
         11 . A heat dissipation member, comprising:
 a heat spreader configured to dissipate heat generated by an electronic part; and   the thermal conducting sheet according to  claim 1  provided on the heat spreader and interposed between the heat spreader and the electronic part.   
     
     
         12 . A semiconductor device, comprising:
 an electronic part;   a heat spreader configured to dissipate heat generated by the electronic part;   a heat sink; and   a thermal conducting sheet provided on the heat spreader and interposed between the heat spreader and the electronic part, or between the heat spreader and the heat sink,   wherein the thermal conducting sheet comprises a binder resin, insulating-coated carbon fibers, and a thermal conducting filler other than the insulating-coated carbon fibers,   wherein the insulating-coated carbon fibers comprise carbon fibers and a coating film over at least part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material, and   wherein the polymerizable material comprises a compound that comprises 2 or more radically polymerizable double bonds.   
     
     
         13 . The semiconductor device according to  claim 12 ,
 wherein the semiconductor device comprises a plurality of the thermal conducting sheets, and one of the thermal conducting sheets is interposed between the heat spreader and the electronic part, and another thermal conducting sheet is interposed between the heat spreader and the heat sink.   
     
     
         14 . The thermal conducting sheet according to  claim 1 ,
 wherein the radically polymerizable double bonds of the polymerizable material are a vinyl group, an acryloyl group, or a methacryloyl group.   
     
     
         15 . The thermal conducting sheet according to  claim 1 ,
 wherein the polymerizable material is divinylbenzene.   
     
     
         16 . The method for producing a thermal conducting sheet according to  claim 8 ,
 wherein the radically polymerizable double bonds of the polymerizable material are a vinyl group, an acryloyl group, or a methacryloyl group.   
     
     
         17 . The method for producing a thermal conducting sheet according to  claim 8 ,
 wherein the polymerizable material is divinylbenzene.