Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Abstract

A semiconductor manufacturing apparatus includes a mounting unit arranged to mount an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate. The apparatus further includes a holding unit arranged to hold the work substrate having the annular member mounted thereto. The apparatus further includes a first fluid supply unit arranged to supply a first fluid to the second substrate of the work substrate held by the holding unit.

1 - 17 . (canceled) 
     
     
         18 . A method for manufacturing a semiconductor device, the method comprising:
 mounting an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate;   holding the work substrate having the annular member mounted thereto; and   supplying a first fluid to the second substrate of the held work substrate.   
     
     
         19 . The method according to  claim 18 , wherein the first fluid is an etching liquid used to perform etching of the second substrate. 
     
     
         20 . A method for manufacturing a semiconductor device, the method comprising:
 holding a work substrate including a first substrate and a second substrate bonded to each other;   supplying a first fluid to the second substrate of the held work substrate; and   supplying a second fluid to a boundary between the first substrate and the second substrate.