Air-conditioned garment having semiconductor cooling system

Abstract

An air-conditioned garment having a semiconductor cooling system comprising a garment body and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprises a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module for generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module.

What is claimed is: 
     
         1 . An air-conditioned garment having a semiconductor cooling system, comprising:
 a garment body, and   a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprising:   a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module, wherein the cold air fan is capable of generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module, wherein the heat conduction module is attached to a second surface of the semiconductor cooling device, and the heat dissipation fan is fixedly arranged on the heat conduction module, wherein the heat dissipation fan is capable of generating a second directional airflow, wherein the first flow guide air cover guides the first directional airflow, wherein the second flow guide air cover covers the exterior of the heat dissipation fan, and wherein an inlet of the second flow guide air cover extends to the exterior of the garment body, wherein the second directional airflow flows out from the garment body after passing through the inlet, the outlet of the second flow guide air cover and the surface of the heat conduction module.   
     
     
         2 . The air-conditioned garment having a semiconductor cooling system of  claim 1 , wherein the semiconductor cooling unit further comprising a power supply, a controller and control buttons. 
     
     
         3 . The air-conditioned garment having a semiconductor cooling system of  claim 1 , wherein the cold air guide module and the heat conduction module are provided with a plurality of airflow channels, and the direction of the airflow channels is directed to the exterior of the garment body from the interior of the garment body, wherein the cold air fan is located on one side of the airflow channel of the cold air guide module facing the exterior of the garment body, and wherein the heat dissipation fan is located on one side of the airflow channel of the heat conduction module facing the interior of the garment body. 
     
     
         4 . The air-conditioned garment having a semiconductor cooling system of  claim 1 , wherein the first flow guide air cover is fixedly arranged on an outer side of the airflow channel of the cold air guide module. 
     
     
         5 . The air-conditioned garment having a semiconductor cooling system of  claim 1 , wherein the second flow guide air cover further comprising a flow guide plate fixedly arranged on an outer side of the airflow channel of the heat conduction module. 
     
     
         6 . The air-conditioned garment having a semiconductor cooling system of  claim 5 , wherein the cold air guide module and the heat conduction module are heat dissipation fins. 
     
     
         7 . The air-conditioned garment having a semiconductor cooling system of  claim 1 , wherein the heat dissipation fins are made of aluminum or copper.