Semiconductor memory device

Abstract

According to one embodiment, a semiconductor memory device includes: first and second memory cells; a first and second word lines; and a first bit line. The device is configured to execute first to sixth operations. In the first operation, a first voltage is applied to the first word line and a second voltage is applied to a semiconductor layer. In the second operation, the first voltage is applied to the second word line. In the third operation, a third voltage is applied to the first word line. In the fourth operation, the third voltage is applied to the second word line. In the fifth operation, a fourth voltage is applied to the first word line. In the sixth operation, the fourth voltage is applied to the second word line.

What is claimed is: 
     
         1 . A memory system comprising:
 a semiconductor memory device; and   a controller configured to control the semiconductor memory device,   wherein   the semiconductor memory device includes:
 a memory pillar including a semiconductor layer, a first memory cell and a second memory cell, the first memory cell being configured to store data, the second memory cell being configured to store data, the first memory cell sharing the semiconductor layer with the second memory cell; 
 a first word line coupled to the first memory cell; 
 a second word line coupled to the second memory cell; 
 a first bit line configured to be electrically coupled to both the first memory cell and the second memory cell; and 
 a circuitry, 
   the controller is configured to send the semiconductor memory device an erase command to erase data stored in the first memory cell and the second memory cell,   in response to the erase command, the circuitry is configured to execute a first operation, a second operation, a third operation, a fourth operation, a fifth operation, and a sixth operation to erase data,   in the first operation, a first voltage is applied to the first word line, and a second voltage higher than the first voltage is applied to the semiconductor layer,   in the second operation, the first voltage is applied to the second word line, and the second voltage is applied to the semiconductor layer,   in the third operation after the first operation, a third voltage lower than the second voltage is applied to the first word line to read data from the first memory cell,   in the fourth operation after the second operation, the third voltage is applied to the second word line to read data from the second memory cell,   in the fifth operation after the third operation, a fourth voltage lower than the third voltage is applied to the first word line to read the data from the first memory cell, and   in the sixth operation after the fourth operation, the fourth voltage is applied to the second word line to read the data from the second memory cell.   
     
     
         2 . The system according to  claim 1 , wherein the fourth voltage is applied to the second word line in the third operation. 
     
     
         3 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   in the third operation, the third voltage is applied to the first word line, a fifth voltage to turn on a memory cell is applied to the third word line, and the fourth voltage is applied to the second word line and the fourth word line; and   thereafter, the fifth voltage is applied to the first word line, the third voltage is applied to the third word line, and the fourth voltage is applied to the second word line and the fourth word line.   
     
     
         4 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   in the third operation, the third voltage is applied to the first word line and the third word line, and the fourth voltage is applied to the second word line and the fourth word line; and   in the fourth operation, the third voltage is applied to the second word line and the fourth word line, and the fourth voltage is applied to the first word line and the third word line.   
     
     
         5 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   in the third operation, the third voltage is applied to the first word line, a fifth voltage to turn on a memory cell is applied to the third word line, the fifth voltage is applied to the second word line, and the third voltage is applied to the fourth word line; and   in the fourth operation, the fifth voltage is applied to the first word line, the third voltage is applied to the third word line, the third voltage is applied to the second word line, and the fifth voltage is applied to the fourth word line.   
     
     
         6 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   the circuitry is further configured to execute the third operation and the fourth operation in parallel, wherein
 in the third operation and the fourth operation, the third voltage is applied to the first word line and the second word line, and a fifth voltage to turn on a memory cell is applied to the third word line and the fourth word line. 
   
     
     
         7 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   the circuitry is further configured to execute the third operation and the fourth operation in parallel, wherein
 in the third operation and the fourth operation, the third voltage is applied to the first to fourth word lines. 
   
     
     
         8 . The system according to  claim 1 , wherein the circuitry is further configured to execute a seventh operation before the first to sixth operations, and
 in the seventh operation, a fifth voltage is applied to the first word line and the second word line, and   the fifth voltage is higher than the first voltage, the third voltage, and the fourth voltage.   
     
     
         9 . The system according to  claim 8 , wherein the circuitry is configured to:
 in the first operation, set a potential of the semiconductor layer to a voltage higher than a gate potential of the first memory cell to lower the threshold voltage of the first memory cell;   in the second operation, set the potential of the semiconductor layer to a voltage higher than a gate potential of the second memory cell to lower the threshold voltage of the second memory cell; and   execute the second operation after the first operation.   
     
     
         10 . The system according to  claim 9 , wherein
 in the fifth operation, the fourth voltage is applied to the first word line and a sixth voltage to turn off the second memory cell is applied to the second word line; and   in the sixth operation, the fourth voltage is applied to the second word line and the sixth voltage is applied to the first word line.   
     
     
         11 . The system according to  claim 10 , wherein
 in the fifth operation, the fifth voltage is applied to the first word line and the sixth voltage is applied to the second word line after the data is read from the first memory cell; and   in the sixth operation, the fifth voltage is applied to the second word line and the sixth voltage is applied to the first word line after the data is read from the second memory cell.   
     
     
         12 . The system according to  claim 9 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   in the fifth operation, the fourth voltage is applied to the first word line and the fourth word line and a sixth voltage to turn off a memory cell is applied to the second word line and the third word line to read the data from the first memory cell and the fourth memory cell; and   in the sixth operation, the fourth voltage is applied to the second word line and the third word line and the sixth voltage is applied to the first word line and the fourth word line to read the data from the second memory cell and the third memory cell.   
     
     
         13 . The system according to  claim 12 , wherein
 in the fifth operation, the fifth voltage is applied to the first word line and the fourth word line and the sixth voltage is applied to the second word line and the third word line after the data is read from the first memory cell and the fourth memory cell; and   in the sixth operation, the fifth voltage is applied to the second word line and the third word line and the sixth voltage is applied to the first word line and the fourth word line after the data is read from the second memory cell and the third memory cell.   
     
     
         14 . The system according to  claim 1 , wherein the circuitry is further configured to execute the fifth operation and the sixth operation in parallel. 
     
     
         15 . The system according to  claim 14 , wherein a fifth voltage is applied to the first word line and the second word line after the data is read from the first memory cell and the second memory cell in the fifth operation and the sixth operation, and
 the fifth voltage is higher than the first voltage, the third voltage, and the fourth voltage.   
     
     
         16 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   the circuitry is further configured to execute the fifth operation and the sixth operation in parallel, and wherein
 in the fifth operation and the sixth operation, the fourth voltage is applied to the first to fourth word lines. 
   
     
     
         17 . The system according to  claim 16 , wherein a fifth voltage is applied to the first to fourth word lines after the fourth voltage is applied to the first to fourth word lines in the fifth operation and the sixth operation, and
 the fifth voltage is higher than the first voltage, the third voltage, and the fourth voltage.   
     
     
         18 . The system according to  claim 1 , wherein the semiconductor memory device further includes:
 a third memory cell capable of holding data;   a fourth memory cell capable of holding data;   a third word line coupled to the third memory cell; and   a fourth word line coupled to the fourth memory cell,   wherein the first to fourth memory cells share the semiconductor layer, and the first memory cell and the third memory cell face the second memory cell and the fourth memory cell across the semiconductor layer, and   in the fifth operation, the fourth voltage is applied to the first word line, a fifth voltage to turn on a memory cell is applied to the third word line and the second word line, and the fourth voltage is applied to the fourth word line; and   in the sixth operation, the fifth voltage is applied to the first word line, the fourth voltage is applied to the second word line and the third word line, the fifth voltage is applied to the fourth word line.   
     
     
         19 . The system according to  claim 18 , wherein
 in the fifth operation, a sixth voltage is applied to the first word line and the fourth word line, after the fourth voltage is applied to the first word line and the fourth word line,   in the sixth operation, the sixth voltage is applied to the first word line and the fourth word line, after the fourth voltage is applied to the second word line and the third word line, and   the sixth voltage is higher than the first voltage, the third voltage, and the fourth voltage.