Micro-molded electrodes, arrays, and methods of making the same

Abstract

A method of manufacturing a micro-molded electrode having multiple individually addressable sensors along a shaft can include forming a recess in a mold substrate, depositing a structural material therein, depositing a conductive material at specific locations, providing a coating, and removing the mold substrate. A micro-molded electrode having a base tapering to at least one shaft can include an electrode substrate, multiple individually addressable sensors, and a coating.

What is claimed is: 
     
         1 . A method of manufacturing a micro-molded electrode having multiple individually addressable sensors along a shaft of the micro-molded electrode, comprising:
 modifying a mold substrate to form a recess therein on a first surface of the mold substrate, the recess defining the perimeter of the micro-molded electrode;   depositing a structural material within the recess to form the micro-molded electrode;   depositing a conductive material at specific locations on the micro-molded electrode such that the conductive material forms the multiple individually addressable sensors along the shaft of each micro-molded electrode, each sensor comprising a bonding pad at a base of the micro-molded electrode electrically connected to an active site on the shaft of the micro-molded electrode via an electrically conductive trace, the micro-molded electrode having an active site on at least two sides of the micro-molded electrode;   coating a top side of the micro-molded electrode and at least one trace with a coating material; and   removing the mold substrate outside the perimeter.   
     
     
         2 . The method of  claim 1 , further comprising depositing a structural material within the recess after the deposition of the conductive material. 
     
     
         3 . The method of  claim 1 , further comprising depositing a structural material within the recess before the deposition of the conductive material. 
     
     
         4 . The method of  claim 3 , further comprising polishing the first surface of the mold substrate after deposition of the structural material. 
     
     
         5 . The method of  claim 3 , wherein the structural material is heated to form a solid cohesive structural material. 
     
     
         6 . The method of  claim 3 , wherein the structural material is selected from the group consisting of silicon, aluminum, alumina, glass, quartz, steel, epoxy-based negative resist materials, acrylics, silicon on insulator (SOD, and combinations thereof. 
     
     
         7 . The method of  claim 1 , wherein the coating material includes parylene-C, polyimide, polyurethane, benzocyclobutene (BCB), polymethyl methacrylate (PMMA), polydimethylsiloxane (PDMS), glass, or mixtures thereof. 
     
     
         8 . The method of  claim 1 , further comprising coating surfaces of the micro-molded electrode exposed by the removal of the substrate outside the perimeter. 
     
     
         9 . The method of  claim 1 , wherein modifying comprises etching the mold substrate. 
     
     
         10 . The method of  claim 9 , wherein etching comprises deep reactive ion etching. 
     
     
         11 . The method of  claim 1 , wherein depositing a conductive material includes a lithography process to form the bond pads, active sites, and electrically conductive traces. 
     
     
         12 . The method of  claim 1 , wherein the coating includes a lithography process using the coating material. 
     
     
         13 . The method of  claim 1 , wherein removing comprises etching the mold substrate. 
     
     
         14 . The method of  claim 13 , wherein etching comprises deep reactive ion etching. 
     
     
         15 . The method of  claim 1 , further comprising forming a channel within the micro-molded electrode adapted to deliver at least one active agent. 
     
     
         16 . The method of  claim 1 , further comprising forming a channel within the micro-molded electrode which is adapted to deliver an electromagnetic radiation. 
     
     
         17 . The method of  claim 1 , further comprising coupling a plurality of the micro-molded electrodes to a slotted base, the slotted base having a plurality of slots which receive the micro-molded electrodes. 
     
     
         18 . The method of  claim 17 , further comprising forming a power module, a processing module, and a transceiver module on the slotted base, wherein the power module electrically powers the processing module, the transceiver module and the sensors. 
     
     
         19 . A micro-molded electrode having a base tapering to at least one shaft, comprising:
 an electrode substrate;   multiple individually addressable sensors on at least one side of the electrode substrate, each individually addressable sensor comprising a bonding pad at the base of the electrode electrically connected to an active site on the shaft of the electrode via an electrically conductive trace, the electrode having an active site on at least two sides of the electrode; and   a coating covering a first side of the electrode including at least one trace.   
     
     
         20 . The micro-molded electrode of  claim 19 , wherein the micro-molded electrode has a semi-conical shaft.