US2022069057A1PendingUtilityA1

Display device including a power supply line that overlaps a driving circuit

Assignee: SAMSUNG DISPLAY CO LTDPriority: Jan 19, 2018Filed: Nov 9, 2021Published: Mar 3, 2022
Est. expiryJan 19, 2038(~11.5 yrs left)· nominal 20-yr term from priority
H10K 59/873H10K 59/8722H10K 59/131H10D 86/441H10D 86/60H10D 86/451H05K 1/189G09G 3/3275G09G 3/3225G09G 3/3208G09G 3/3233G09G 3/3266G09G 2300/0408H05K 2201/10128G09G 2300/0426H01L 27/3276H01L 51/5206H01L 51/5221H01L 27/124H01L 51/5246H10K 59/124H10K 59/35H10K 59/1213H10K 50/82H10K 59/1216H10K 50/8426H10K 50/81H10K 59/805H10K 59/121
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Claims

Abstract

A display device includes a substrate. The display unit is disposed on the substrate and includes a pixel circuit and a display element electrically connected to the pixel circuit. A driving circuit is disposed outside of the display unit. The driving circuit includes a thin film transistor. An inorganic insulating layer is disposed on the driving circuit. A power supply line is disposed on the inorganic insulating layer, overlaps the driving circuit, and is connected to a common electrode of the display element. An encapsulation substrate is disposed on the power supply line and faces the substrate. A sealing material is interposed between the substrate and the encapsulation substrate and overlaps the driving circuit.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A display device comprising:
 a substrate;   a display unit disposed on the substrate and comprising a pixel circuit and a display element electrically connected to the pixel circuit;   a driving circuit disposed outside of the display unit, the driving circuit comprising a thin film transistor;   an inorganic insulating layer disposed on the driving circuit;   a power supply line disposed on the inorganic insulating layer and electrically connected to a common electrode of the display element;   an encapsulation substrate disposed on the power supply line and facing the substrate; and   a sealing material interposed between the substrate and the encapsulation substrate,   wherein a portion of the sealing material, a portion of the power supply line, and a portion of the driving circuit overlap each other,   wherein the inorganic insulating layer partially overlaps a connection line and the power supply line is directly electrically connected to the connection line through a contact hole in the inorganic insulating layer that is overlapped by the sealing material, and   wherein the inorganic insulating layer forms a pair of stepped-up portions where it overlaps opposite ends of the connection line across the contact hole in the inorganic insulating layer and the sealing material covers both of the pair of stepped-up portions of the inorganic insulating layer.

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