Template, template manufacturing method, and semiconductor device manufacturing method

Abstract

According to one embodiment, a template for imprint patterning processes comprises a template substrate having a first surface and a pedestal on the first surface of the template substrate, the pedestal having a second surface spaced from the first surface in a first direction perpendicular to the first surface. A pattern is disposed on the second surface. The pedestal has a sidewall between the first surface and the second surface that is at an angle of less than 90° to the second surface.

What is claimed is: 
     
         1 . A template for imprint patterning processes, comprising:
 a template substrate having a first surface; and   a pedestal on the first surface of the template substrate, the pedestal having a second surface spaced from the first surface in a first direction perpendicular to the first surface, and a resin material pattern disposed on the second surface.   
     
     
         2 . The template according to  claim 1 , wherein
 the pattern is disposed in a pattern arrangement region in a central portion of the second surface surrounded on the second surface by a mark arrangement region outside the pattern arrangement region between the central portion and an outer edge of the second surface, and   the pattern arrangement region does not extend laterally along the second surface beyond an outermost position of a projected outline of a direct contact region between the pedestal and the first surface.   
     
     
         3 . The template according to  claim 1 , wherein the pedestal is a resin material. 
     
     
         4 . The template according to  claim 1 , wherein the pedestal and the template substrate are formed of the same material. 
     
     
         5 . A method of manufacturing a template for imprint patterning processes, comprising:
 forming a guide layer on a first surface of a template substrate, the guide layer having an opening exposing the first surface, a sidewall of the opening including an angled portion that extends to form an interior angle within the guide layer that is less than 90° with respect to the first surface;   depositing a curable material in the opening;   curing the curable material; and   removing the guide layer while leaving the cured curable material.