Treated particles and substrates

Abstract

The present invention is directed to a particle having a chemical conversion coating on at least a portion of the particle surface. The present invention is further directed to a coated substrate comprising: (a) a surface that has been contacted with a particle having a chemical conversion coating on at least a portion of the particle surface such that at least some portion of the substrate becomes treated with the conversion coating.

What is claimed is: 
     
         1 . A particle having a chemical conversion coating on at least a portion of the particle surface. 
     
     
         2 . The particle of  claim 1 , wherein the chemical conversion coating comprises a phosphate, such as zinc phosphate. 
     
     
         3 . The particle of any preceding Claim, wherein the chemical conversion coating comprises an oxide, such as zirconium oxide. 
     
     
         4 . The particle of any preceding Claim, wherein the chemical conversion coating is chemically attached to the particle using an electric current. 
     
     
         5 . A substrate comprising:
 (a) a surface that has been contacted with a particle having a chemical conversion coating on at least a portion of the particle surface such that at least some portion of the substrate becomes treated with the conversion coating.   
     
     
         6 . The substrate of  claim 5 , wherein the conversion coating on the substrate forms a continuous layer or semi-continuous, at least a portion of the layer has a thickness of 1 to 50 nanometers as determined by TEM. 
     
     
         7 . A substrate comprising a conversion coating deposited on at least a portion thereof, wherein the conversion coating forms a continuous layer or a semi-continuous layer and wherein the layer is substantially free of fluorine, essentially free of fluorine, or completely free of fluorine as determined by XRF. 
     
     
         8 . A substrate comprising a conversion coating deposited on at least a portion thereof, wherein the conversion coating forms a continuous layer, a semi-continuous layer, or semi-continuous deposits, and wherein the conversion coating has a barrier per thickness of 1.3×10 8  to 6.9×10 9  Ω-cm (Ohms×area/coating layer thickness) as determined by electrochemical impedance spectroscopy. 
     
     
         9 . A substrate comprising a conversion coating deposited on at least a portion thereof, wherein the conversion coating has a shattered crystalline morphology. 
     
     
         10 . The substrate of any preceding Claim, wherein the chemical conversion coating comprises a phosphate, such as zinc phosphate, and/or an oxide, such as zirconium oxide. 
     
     
         11 . The substrate of any preceding Claim, wherein the substrate is further coated at least in part with (b) a film-forming layer deposited from a film-forming composition, such as a film-forming composition that is powder or liquid, such as a liquid that is solvent-borne, water-borne, electrodepositable, or 100 percent solids. 
     
     
         12 . The substrate of any preceding Claim, further comprising (c) one or more additional film-forming layers deposited from film-forming compositions that are the same or different from the first film-forming composition. 
     
     
         13 . The substrate of any preceding  claim 6 , wherein any of the film-forming layers comprise epoxy, urethane and/or siloxane. 
     
     
         14 . The substrate of any preceding Claim, wherein the substrate comprises at least part of an article, such as a structure, a vehicle, a pipe, shipping container or a storage tank. 
     
     
         15 . A method for treating a substrate comprising contact at least a portion of the surface of the substrate with a particle having a conversion coating on at least a portion of the particle surface, so as to impart the desired level of transfer of the conversion coating from the particle to the substrate. 
     
     
         16 . The method of  claim 15 , further comprising applying a film-forming layer to at least a portion of the treated substrate, wherein the film-forming layer is deposited from a film-forming composition, such as a film-forming composition that is powder or liquid, such as a liquid that is solvent-borne, water-borne, electrodepositable, or 100 percent solids. 
     
     
         17 . The method of  claim 16 , further comprising (c) one or more additional film-forming layers deposited from film-forming composition that are the same or different from the first film-forming composition.