Camera assembly, lens module, and electronic device

Abstract

The present disclosure provides a camera assembly, a lens module, and an electronic device. The camera assembly includes a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure. The photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip. The RDL structure and the optical filter are exposed from a top surface of the encapsulation layer. A highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer. The photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.

What is claimed is: 
     
         1 . A camera assembly, comprising:
 a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure, wherein:   the photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip;   the RDL structure and the optical filter are exposed from a top surface of the encapsulation layer; and   a highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer,   wherein the photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.   
     
     
         2 . The camera assembly according to  claim 1 , wherein the RDL structure includes an interconnect line. 
     
     
         3 . The camera assembly according to  claim 2 , further comprising:
 conductive bumps between the RDL, structure and the corresponding solder pads, wherein the conductive bumps are planting balls.   
     
     
         4 . The camera assembly according to  claim 1 , wherein the RDL structure comprises an interconnection line and conductive pillars protruding from the interconnection line, and the conductive pillars are located between the interconnection line and the corresponding solder pads. 
     
     
         5 . The camera assembly according to  claim 1 , further comprising:
 a stress buffer layer, between sidewalk of the optical filter and the encapsulation layer.   
     
     
         6 . The camera assembly according to  claim 1 , wherein the functional components comprise at least one of peripheral chips and passive components, and the peripheral chips comprise one or two of digital signal processor chips and memory chips. 
     
     
         7 . The camera assembly according to  claim 1 , further comprising:
 a flexible printed circuit (FPC) board, bonded with a portion of the RDL structure exposed from the encapsulation layer.   
     
     
         8 . A lens module, comprising:
 the camera assembly according to claim I; and   a lens assembly, comprising a support member, wherein the support member is mounted on a top surface of the encapsulation layer and surrounds the photosensitive unit and the functional components, and the lens assembly electrically connects with the photosensitive chip and the functional components.   
     
     
         9 . An electronic device, comprising the lens module according to  claim 8 .