US2022037390A1PendingUtilityA1

Solid-state image pickup device

Assignee: CANON KKPriority: Jul 9, 2010Filed: Oct 19, 2021Published: Feb 3, 2022
Est. expiryJul 9, 2030(~3.9 yrs left)· nominal 20-yr term from priority
H10W 72/932H10W 72/934H10W 72/921H10W 72/952H10W 72/9415H10W 72/923H10W 72/01951H10W 80/312H10W 80/327H10W 72/941H10W 72/019H10W 72/90H10W 90/792H10W 80/701H10F 39/8053H10F 39/809H10F 39/199H10F 39/182H10F 39/80H10F 39/026H10F 39/024H10F 39/018H10F 30/10H10F 39/811H01L 27/14634H01L 27/1464H01L 27/14687H01L 27/14601H01L 27/14621H01L 27/1469H01L 27/14685H01L 31/09H01L 27/14636H01L 27/14645
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Claims

Abstract

A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.

Claims

exact text as granted — not AI-modified
1 . A device comprising:
 a first substrate;   a second substrate which overlaps the first substrate;   a first structure which is between the first substrate and the second substrate, the first structure including a first film of a dielectric material and a first portion of a conductive material, the first portion being in a groove of the first film; and   a second structure which is between the first structure and the second substrate, the second structure including a second film of a dielectric material and a second portion of a conductive material, the second portion being in a groove of the second film,   wherein the first film is bonded to the second film, and the first portion is bonded to the second portion, and   wherein the first film includes an insulating film which is a silicon nitride film or a silicon carbide film.

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