Light-emitting device and method for manufacturing light-emitting device

Abstract

A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member located over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

1 . A light-emitting device comprising:
 a mounting board;   at least one light-emitting element located on or above the mounting board;   a first covering member comprising, in order from an upper surface of the mounting board:
 a containing layer comprising a light-absorbing material, and 
 a light-transmissive layer; and 
   a second covering member located over the first covering member and the light-emitting element;   wherein a thickness of the containing layer is less than a thickness of the light-emitting element.   
     
     
         2 . The light-emitting device according to  claim 1 , wherein the at least one light-emitting element comprises a plurality of light-emitting elements. 
     
     
         3 . The light-emitting device according to  claim 1 , wherein the first covering member is softer than the second covering member. 
     
     
         4 . The light-emitting device according to  claim 1 , wherein the at least one light-emitting element is face-up mounted. 
     
     
         5 . The light-emitting device according to  claim 1 , further comprising a third covering member comprising a reflective material and covering a lateral surface of the at least one light-emitting element. 
     
     
         6 . The light-emitting device according to  claim 1 , wherein the light-absorbing material of the containing layer is concentrated at the upper surface of the mounting board in a sectional view. 
     
     
         7 . The light-emitting device according to  claim 1 , wherein the second covering member is further disposed at least a portion of lateral surfaces of the light-emitting element. 
     
     
         8 . The light-emitting device according to  claim 1 , wherein a thickness of the first covering member is in a range of 10 μm to 100 μm. 
     
     
         9 . The light-emitting device according to  claim 1 , wherein the thickness of the containing layer is 20% or less of a thickness of the first covering member. 
     
     
         10 . The light-emitting device according to  claim 1 , wherein a concentration of the light-absorbing material in the containing layer is in a range of 2.5 mass % to 20.0 mass %. 
     
     
         11 . The light-emitting device according to  claim 1 , wherein the thickness of the containing layer is ¼ or less of the thickness of lateral surfaces of the light-emitting element. 
     
     
         12 . The light-emitting device according to  claim 1 , wherein the light-absorbing material is carbon black. 
     
     
         13 . The light-emitting device according to  claim 1 , wherein the mounting board includes an insulating member and wiring portions,
 wherein the mounting board has further a recessed portion defined by the insulating member and the wiring portions.   
     
     
         14 . The light-emitting device according to  claim 13 , wherein the at least one light-emitting element is placed on or above a bottom surface of the recessed portion. 
     
     
         15 . The light-emitting device according to  claim 13 , further comprising a fourth covering member,
 wherein the fourth covering member is spaced apart from lateral surfaces of the light-emitting element and is placed lateral surfaces of the recessed portion.