Encapsulation cover for an electronic package and fabrication process

Abstract

An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

1 . An encapsulation cover for an electronic package, comprising:
 a cover body;   a metal insert;   wherein a first part of the cover body and a first part of the metal insert form a frontal wall of said encapsulation cover having a through-passage extending from a first face to a second face, said first part of the metal insert embedded in the first part of the cover body;   wherein a second part of the cover body and a second part of the metal insert further form a peripheral wall of said encapsulation cover that protrudes from the second face of the frontal wall, said second part of the metal insert embedded in the second part of the cover body; and   an optical element located within the through-passage and configured to allow passage of light.   
     
     
         2 . The encapsulation cover according to  claim 1 , wherein said second part of the metal insert extends backward from an edge of the first part of the metal insert. 
     
     
         3 . The encapsulation cover according to  claim 1 , wherein said second part of the metal insert has an end face that is not covered by the second part of the cover body. 
     
     
         4 . The encapsulation cover according to  claim 3 , wherein an end face of the second part of the cover body is coplanar with said end face of the second part of the metal insert. 
     
     
         5 . The encapsulation cover according to  claim 4 , wherein said coplanar end faces present a surface for attachment by means of an adhesive material to a front surface of a substrate to which said encapsulation cover is mounted to form said electronic package. 
     
     
         6 . The encapsulation cover according to  claim 5 , wherein said end face of the second part of the metal insert is configured to make electrical contact to a conductive element supported by said substrate. 
     
     
         7 . The encapsulation cover according to  claim 6 , where said conductive element is a through-via. 
     
     
         8 . The encapsulation cover according to  claim 5 , wherein said adhesive material is thermally conductive. 
     
     
         9 . The encapsulation cover according to  claim 1 , wherein said through-passage extends through said first part of the metal insert. 
     
     
         10 . The encapsulation cover according to  claim 1 , wherein said metal insert at least partly surrounds said optical element. 
     
     
         11 . The encapsulation cover according to  claim 1 , wherein said optical element is attached to said metal insert in the through-passage. 
     
     
         12 . The encapsulation cover according to  claim 1 , wherein said through-passage extends at least partly through said cover body. 
     
     
         13 . The encapsulation cover according to  claim 12 , wherein at least part of said cover body is in contact with said optical element in the through-passage. 
     
     
         14 . The encapsulation cover according to  claim 1 , wherein an inside edge of said metal insert at the through-passage is separated by a distance from said optical element, wherein said cover body includes a portion positioned between said optical element and said edge of the metal insert. 
     
     
         15 . The cover according to  claim 1 , wherein the metal insert has at least one face that is not covered by the cover body. 
     
     
         16 . The cover according to  claim 1 , wherein said cover body comprises a peripheral rim that surrounds the metal insert. 
     
     
         17 . The cover according to  claim 1 , wherein said cover body comprises at least one inner wall. 
     
     
         18 . An electronic package, comprising:
 a substrate wafer;   an electronic component including at least one of an optical sensor or an optical emitter that is mounted on top of a face of the substrate wafer; and   an encapsulation cover as recited in  claim 1  that is mounted on said face of the substrate wafer so as to form a chamber in which the electronic component is located.   
     
     
         19 . The electronic package according to  claim 18 , wherein said second part of the metal insert extends backward from an edge of the first part of the metal insert. 
     
     
         20 . The electronic package according to  claim 18 , wherein said second part of the metal insert has an end face that is not covered by the second part of the cover body. 
     
     
         21 . The electronic package according to  claim 20 , wherein an end face of the second part of the cover body is coplanar with said end face of the second part of the metal insert. 
     
     
         22 . The electronic package according to  claim 21 , wherein said coplanar end faces present a surface for attachment by means of an adhesive material to a front surface of a substrate to which said encapsulation cover is mounted to form said electronic package. 
     
     
         23 . The electronic package according to  claim 22 , wherein said end face of the second part of the metal insert is configured to make electrical contact to a conductive element supported by said substrate. 
     
     
         24 . The electronic package according to  claim 23 , where said conductive element is a through-via. 
     
     
         25 . The electronic package according to  claim 22 , wherein said adhesive material is thermally conductive. 
     
     
         26 . An encapsulation cover for an electronic package, comprising:
 a cover body;   a metal insert embedded in the cover body;   wherein the cover body forms a frontal wall and opposed peripheral walls extending rearwardly from said frontal wall;   wherein the metal insert includes a front metal portion embedded within the frontal wall and opposed end metal portions embedded within the opposed peripheral walls;   wherein the metal portion includes a through-passage; and   an optical element located within the through-passage and configured to allow through passaged of light.