Antimicrobial metallized thin films for refurbishing communal contact surfaces

Abstract

An antimicrobial metallized thin film is provided that can be quickly and easily attached to surfaces of objects. This film includes a polymer substrate onto which a metallized layer is formed. The metallized layer comprises an exposed antimicrobial metal physical contact surface. Ions from this physical contact surface destroy the viral coating and ribonucleic acid of contacting viruses rendering the viruses inactive and noninfectious. The film can be attached via an adhesive layer disposed between and in contact with the polymer substrate and the communal surface. This arrangement allows the film to economically refurbish communal surfaces with a film overlay rather than completely replacing communal surfaces with antimicrobial materials. The film mitigates the likelihood of viruses such as coronaviruses, noroviruses, rhinoviruses, and the like from spreading due to contact with the refurbished communal surfaces.

What is claimed is: 
     
         1 . An antimicrobial metallized thin film, comprising:
 a substrate layer having a first side and a second side disposed opposite and offset from the first side by a substrate layer thickness, the substrate layer extending planarly over a length and width of the substrate layer;   a metallized layer formed on the first side of the substrate layer at a total metal thickness of less than 8.0μ, the metallized layer comprising an antimicrobial metal, wherein a physical contact surface of the antimicrobial metal is exposed and uncovered along at least one of the length and width of the substrate layer; and   an adhesive layer formed on the second side of the substrate layer and extending an adhesive layer thickness to an adhesive attachment surface.   
     
     
         2 . The antimicrobial metallized thin film of  claim 1 , wherein the antimicrobial metal is at least 90% copper. 
     
     
         3 . The antimicrobial metallized thin film of  claim 2 , wherein the metallized layer completely covers the first side of the substrate layer. 
     
     
         4 . The antimicrobial metallized thin film of  claim 2 , wherein the metallized layer comprises:
 a pre-metallization layer deposited on the first side of the substrate layer at a deposition thickness measured in a range from 0.05μ to 0.5μ; and   an antimicrobial metal plating layer plated onto the pre-metallization layer at a plating thickness measured in a range from 1.0μ to 5.0μ, the antimicrobial metal plating layer comprising the physical contact surface spaced apart from the first side of the substrate layer by the deposition thickness and the plating thickness.   
     
     
         5 . The antimicrobial metallized thin film of  claim 4 , wherein the substrate layer is a polymer film. 
     
     
         6 . The antimicrobial metallized thin film of  claim 4 , wherein the deposition thickness is measured in a range from 0.1μ to 0.2μ, wherein the plating thickness is measured in a range from 2.0μ to 5.0μ, wherein the substrate layer is measured in a range from 25μ to 75μ, and wherein the polymer film is a nonconductive material. 
     
     
         7 . The antimicrobial metallized thin film of  claim 6 , wherein the pre-metallization layer is printed onto the first side of the substrate layer via at least one of a silver, a copper, and a graphite metallic printing ink. 
     
     
         8 . The antimicrobial metallized thin film of  claim 6 , wherein the antimicrobial metallized thin film is wound in a roll onto a core. 
     
     
         9 . The antimicrobial metallized thin film of  claim 6 , wherein the adhesive layer comprises at least one of a pressure-sensitive adhesive material, a solvent-based adhesive material, and a thermoplastic adhesive material. 
     
     
         10 . The antimicrobial metallized thin film of  claim 9 , further comprising:
 a release liner attached to the adhesive attachment surface, wherein the release liner is coated with a nonstick layer of silicone on an adhesive contact surface of the release liner.   
     
     
         11 . The antimicrobial metallized thin film of  claim 10 , wherein the antimicrobial metal is brass comprising 90% copper and 10% zinc. 
     
     
         12 . The antimicrobial metallized thin film of  claim 10 , wherein the antimicrobial metal is brass comprising 95% copper and 5% zinc. 
     
     
         13 . An antimicrobial metallized substrate, comprising:
 a polymer film having a first surface and a second surface disposed opposite the first surface, the first surface offset from the second surface by a film thickness, the polymer film providing a metallization area on the first surface;   a pre-metallization material layer comprising a conductive metal deposited on the metallization area of the first surface;   a metal layer comprising at least 90% copper plated onto the pre-metallization material layer at a metal thickness measured in a range from 2.0μ to 5.0 microns, wherein the metal layer comprises an exposed contact surface that is uncovered along a complete length of the polymer film; and   an adhesive layer formed on the second surface of the substrate layer and extending an adhesive layer thickness to an adhesive attachment surface.   
     
     
         14 . The antimicrobial metallized substrate of  claim 13 , wherein the pre-metallization layer is printed onto the first side of the substrate layer via at least one of a silver, a copper, and a graphite metallic printing ink. 
     
     
         15 . The antimicrobial metallized substrate of  claim 13 , wherein the metal layer deactivates contacting viral ribonucleic acid (“RNA”). 
     
     
         16 . The antimicrobial metallized substrate of  claim 13 , wherein the metal layer is brass comprising 95% copper and 5% zinc. 
     
     
         17 . The antimicrobial metallized substrate of  claim 13 , wherein the pre-metallization material layer is vapor-deposited on metallization area of the first surface at a deposition thickness measured in a range from 0.1μ to 0.2μ, and wherein the film thickness is measured in a range from 25μ to 75μ. 
     
     
         18 . The antimicrobial metallized substrate of  claim 13 , wherein the film thickness is at least 200μ, and wherein the antimicrobial metallized substrate is shaped as a laminate sheet having a total length and a total width. 
     
     
         19 . A method of refurbishing a communal surface of an object by attaching an antimicrobial metallized thin film to the surface, comprising:
 providing the antimicrobial metallized thin film, comprising:
 a substrate layer having a first side and a second side disposed opposite and offset from the first side by a substrate layer thickness, the substrate layer extending planarly over a length and width of the substrate layer; 
 a pre-metallization layer of metal deposited onto the first side of the substrate layer at a deposition thickness; and 
 an antimicrobial metal plating layer plated onto the pre-metallization layer at a plating thickness, wherein the antimicrobial metal plating layer comprises an antimicrobial metal selected from at least one of copper, silver, zinc, and cadmium, and wherein a physical contact surface of the antimicrobial metal is uncovered along at least one of the length and width of the substrate layer; and 
   selecting the communal surface of the object to be refurbished with the antimicrobial metallized thin film; and   attaching the second side of substrate layer to the communal surface of the object to be refurbished causing the antimicrobial metallized thin film to remain on the communal surface of the object such that the antimicrobial metal is exposed to physical contact.   
     
     
         20 . The method of  claim 19 , wherein prior to attaching the second side of substrate layer to the communal surface of the object to be refurbished, the method further comprises:
 applying an adhesive material to the communal surface of the object to be refurbished;   cutting the antimicrobial metallized thin film to a size of the communal surface of the object to be refurbished; and   adhering at least a portion of the second side of the substrate layer to the adhesive material applied to the communal surface of the object to be refurbished.