Azeotropic and azeotrope-like compositions comprising z-1,1,1,4,4,4-hexafluoro-2-butene and methyl perfluoropropyl ether

Abstract

Disclosed are azeotropic or azeotrope-like compositions containing Z-1,1,1,4,4,4-hexafluoro-2-butene and methyl perfluoropropyl ether. Also disclosed is process of using the azeotropic or azeotrope-like composition as blowing agents for preparing a thermoplastic or thermoset foam. Also disclosed is a process of using the azeotropic or azeotrope-like composition as a refrigerant for producing cooling or heating. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as solvents. Also disclosed is a process of using the azeotropic or azeotrope-like composition as propellants for producing an aerosol. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as heat transfer media. Also disclosed is a process of extinguishing or suppressing a fire by using such azeotropic or azeotrope-like compositions. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as dielectrics.

1 - 16 . (canceled) 
     
     
         17 . A process comprising using an azeotrope-like composition consisting essentially of:
 (a) Z-1,1,1,4,4,4-hexafluoro-2-butene; and   (b) methyl perfluoropropyl ether; wherein the methyl perfluoropropyl ether is present in an effective amount to form an azeotrope-like combination with the Z-1,1,1,4,4,4-hexafluoro-2-butene;   as a heat transfer media.   
     
     
         18 . A method for transferring heat comprising:
 a. providing a device; and   b. using a heat-transfer fluid to transfer heat to or from the device, wherein the heat transfer fluid consists essentially of an azeotrope-like composition consisting essentially of:   (a) Z-1,1,1,4,4,4-hexafluoro-2-butene; and   (b) methyl perfluoropropyl ether; wherein the methyl perfluoropropyl ether is present in an effective amount to form an azeotrope-like combination with the Z-1,1,1,4,4,4-hexafluoro-2-butene.   
     
     
         19 - 38 . (canceled) 
     
     
         39 . A apparatus comprising a device and a mechanism for transferring heat to or from the device using a heat-transfer fluid, wherein the heat-transfer fluid consists essentially of an azeotrope-like composition consisting essentially of:
 (a) Z-1,1,1,4,4,4-hexafluoro-2-butene; and   (b) methyl perfluoropropyl ether; wherein the methyl perfluoropropyl ether is present in an effective amount to form an azeotrope-like combination with the Z-1,1,1,4,4,4-hexafluoro-2-butene.   
     
     
         40 . The apparatus of  claim 39 , wherein the apparatus is chosen from refrigeration systems, cooling systems, testing equipment, and machining equipment. 
     
     
         41 . The apparatus of  claim 39 , wherein the apparatus is chosen from test heads used in automated test equipment for testing the performance of semiconductor dice; wafer chucks used to hold silicon wafers in ashers, steppers, etchers, PECVD tools; constant temperature baths, and thermal shock test baths. 
     
     
         42 . The apparatus of  claim 39 , wherein the device is chosen from electrical components, mechanical components and optical components. 
     
     
         43 . The apparatus of  claim 39 , wherein the device is chosen from microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical distribution switch gear, power transformers, circuit boards, multi-chip modules, packaged and unpackaged semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components. 
     
     
         44 . The apparatus of  claim 39 , wherein the mechanism is placed in thermal contact with the device. 
     
     
         45 . The apparatus of  claim 39 , wherein the mechanism comprises facilities for managing the heat-transfer fluid, chosen from pumps, valves, fluid containment systems, pressure control systems, condensers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems. 
     
     
         46 . The apparatus of  claim 45 , wherein the mechanism comprises a heat sink and the heat sink comprises a vapor compression chiller system. 
     
     
         47 . The apparatus of  claim 39 , wherein the mechanism is chosen from temperature controlled wafer chucks in PECVD tools, temperature controlled test heads for die performance testing, temperature controlled work zones within semiconductor process equipment, thermal shock test bath liquid reservoirs, and constant temperature baths. 
     
     
         48 . The apparatus of  claim 39  wherein the upper desired operating temperature is 150° C.