Technologies for dynamic cooling in a multi-chip package with programmable impingement valves

Abstract

Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

1 . A computing device comprising:
 a multi-chip package comprising a plurality of dies;   a cold plate coupled to the multi-chip package, wherein the cold plate comprises a plurality of fluid passage zones, wherein each fluid passage zone is positioned adjacent to a corresponding die of the plurality of dies; and   a plurality of valves, wherein each valve is coupled to a fluid passage zone and is configured to control fluid flow into the fluid passage zone.   
     
     
         2 . The computing device of  claim 1 , further comprising:
 a power control unit to:   read a predetermined die junction temperature for a first die of the plurality of dies;   determine a current die junction temperature of the first die;   compare the current die junction temperature to the predetermined die junction temperature; and   determine a fluid flow rate based on comparing the current die junction temperature and the predetermined die junction temperature; and   a nozzle control unit to control one or more valves of the plurality of valves based on the fluid flow rate, wherein the one or more valves are coupled to a fluid passage zone that is positioned adjacent to the first die.   
     
     
         3 . The computing device of  claim 2 , wherein:
 to compare the current die junction temperature to the predetermined die junction temperature comprises to determine whether the current die junction temperature is less than the predetermined die junction temperature; and   to determine the fluid flow rate based on comparing the current die junction temperature and the predetermined die junction temperature comprises to:   increase the fluid flow rate in response to a determination that the current die junction temperature is not less than the corresponding predetermined die junction temperature; and   decrease the fluid flow rate in response to a determination that the current die junction temperature is less than the corresponding predetermined die junction temperature.   
     
     
         4 . The computing device of  claim 2 , wherein the predetermined die junction temperature comprises an optimal die junction temperature, wherein the first die has a minimum power dissipation at the optimal die junction temperature. 
     
     
         5 . The computing device of  claim 2 , wherein to read the predetermined die junction temperature comprises to read one or more fuses of the computing device. 
     
     
         6 . The computing device of  claim 2 , wherein to determine the current die junction temperature comprises to read a digital temperature sensor of the multi-chip package. 
     
     
         7 . The computing device of  claim 1 , wherein the plurality of dies comprises a processor core, a graphics processing unit, a field-programmable gate array, a host fabric interface, a multi-channel memory die, or a high-bandwidth memory die. 
     
     
         8 . The computing device of  claim 2 , wherein the computing device comprises a manageability controller, wherein the manageability controller comprises the power control unit and the nozzle control unit. 
     
     
         9 . The computing device of  claim 8 , wherein the multi-chip package comprises a processor separate from the manageability controller. 
     
     
         10 . The computing device of  claim 8 , wherein the manageability controller comprises a baseboard management controller. 
     
     
         11 . The computing device of  claim 1 , wherein the multi-chip package comprises an integrated heat spreader coupled to the cold plate. 
     
     
         12 . The computing device of  claim 1 , wherein the multi-chip package comprises an integrated heat spreader that includes the cold plate, wherein the integrated heat spreader comprises the fluid passage zone. 
     
     
         13 . The computing device of  claim 12 , wherein the integrated heat spread comprises a direct impingement integrated heat spreader wherein the fluid passage zone adjacent to the each die directly impinges on the corresponding die. 
     
     
         14 . A method comprising:
 reading, by a computing device, a predetermined die junction temperature for a first die of a plurality of dies of a multi-chip package of the computing device;   determining, by the computing device, a current die junction temperature of the first die;   comparing, by the computing device, the current die junction temperature to the predetermined die junction temperature;   determining, by the computing device, a fluid flow rate based on comparing the current die junction temperature and the predetermined die junction temperature; and   controlling, by the computing device, one or more valves based on the fluid flow rate, wherein the one or more valves are coupled to a fluid passage zone of a cold plate, wherein the fluid passage zone is positioned adjacent to the first die, and wherein the one or more valves are configured to control fluid flow into the fluid passage zone.   
     
     
         15 . The method of  claim 14 , wherein:
 comparing the current die junction temperature to the predetermined die junction temperature comprises determining whether the current die junction temperature is less than the predetermined die junction temperature; and   determining the fluid flow rate based on comparing the current die junction temperature and the predetermined die junction temperature comprises:   increasing the fluid flow rate in response to determining that the current die junction temperature is not less than the corresponding predetermined die junction temperature; and   decreasing the fluid flow rate in response to determining that the current die junction temperature is less than the corresponding predetermined die junction temperature.   
     
     
         16 . The method of  claim 14 , wherein the predetermined die junction temperature comprises an optimal die junction temperature, wherein the first die has a minimum power dissipation at the optimal die junction temperature. 
     
     
         17 . The method of  claim 14 , wherein the plurality of dies comprises a processor core, a graphics processing unit, a field-programmable gate array, a host fabric interface, a multi-channel memory die, or a high-bandwidth memory die. 
     
     
         18 . The method of  claim 14 , wherein the computing device comprises a manageability controller, and wherein:
 determining the fluid flow rate comprises determining the fluid flow rate by the manageability controller; and   controlling the one or more valves comprises controlling the one or more valves by the manageability controller.   
     
     
         19 . One or more computer-readable storage media comprising a plurality of instructions that in response to being executed cause a computing device to:
 read a predetermined die junction temperature for a first die of a plurality of dies of a multi-chip package of the computing device;   determine a current die junction temperature of the first die;   compare the current die junction temperature to the predetermined die junction temperature;   determine a fluid flow rate based on comparing the current die junction temperature and the predetermined die junction temperature; and   control one or more valves based on the fluid flow rate, wherein the one or more valves are coupled to a fluid passage zone of a cold plate, wherein the fluid passage zone is positioned adjacent to the first die, and wherein the one or more micro nozzle valves are configured to control fluid flow into the fluid passage zone.   
     
     
         20 . The one or more computer-readable storage media of  claim 19 , wherein:
 to compare the current die junction temperature to the predetermined die junction temperature comprises to determine whether the current die junction temperature is less than the predetermined die junction temperature; and   to determine the fluid flow rate based on comparing the current die junction temperature and the predetermined die junction temperature comprises to:   increase the fluid flow rate in response to determining that the current die junction temperature is not less than the corresponding predetermined die junction temperature; and   decrease the fluid flow rate in response to determining that the current die junction temperature is less than the corresponding predetermined die junction temperature.   
     
     
         21 . The one or more computer-readable storage media of  claim 19 , wherein the predetermined die junction temperature comprises an optimal die junction temperature, wherein the first die has a minimum power dissipation at the optimal die junction temperature. 
     
     
         22 . The one or more computer-readable storage media of  claim 19 , wherein the plurality of dies comprises a processor core, a graphics processing unit, a field-programmable gate array, a host fabric interface, a multi-channel memory die, or a high-bandwidth memory die. 
     
     
         23 . The one or more computer-readable storage media of  claim 19 , wherein the computing device comprises a manageability controller, and wherein:
 to determine the fluid flow rate comprises to determine the fluid flow rate by the manageability controller; and   to control the one or more valves comprises to control the one or more valves by the manageability controller.   
     
     
         24 . The one or more computer-readable storage media of  claim 23 , wherein the multi-chip package comprises a processor separate from the manageability controller. 
     
     
         25 . The one or more computer-readable storage media of  claim 23 , wherein the manageability controller comprises a baseboard management controller.