US2022005799A1PendingUtilityA1

Light emitting diode device and method of manufacturing the same

Assignee: SAMSUNG DISPLAY CO LTDPriority: Dec 6, 2017Filed: Sep 20, 2021Published: Jan 6, 2022
Est. expiryDec 6, 2037(~11.4 yrs left)· nominal 20-yr term from priority
H10P 50/246H10W 90/00H10D 86/441H10H 20/857H10H 29/142H10D 86/60H10H 20/0364H10H 20/0362H10H 20/853H10H 20/819H10H 20/84H10H 20/01H01L 33/54H01L 21/30621H01L 25/0753H01L 25/167H01L 2933/005H01L 33/62H01L 33/20H01L 27/124H01L 33/005H01L 33/44
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Claims

Abstract

A light emitting diode device includes a thin film transistor substrate having a plurality of light emitting areas, a first diode electrode and a second diode electrode on the thin film transistor substrate, a first passivation pattern between the first diode electrode and the second diode electrode, a plurality of micro light emitting diodes on the first passivation pattern, a first bridge pattern on the micro light emitting diodes and electrically connecting the first diode electrode to the micro light emitting diodes, and a second bridge pattern on the first bridge pattern and electrically connecting the second diode electrode to the micro light emitting diodes, wherein each sidewall of each of the micro light emitting diodes and each sidewall of the first passivation pattern form a same plane.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of manufacturing a light emitting diode device, the method comprising:
 preparing a thin film transistor substrate;   forming a first diode electrode and a second diode electrode on the thin film transistor substrate;   forming a first passivation pattern, a micro light emitting diode, and a second passivation pattern between the first diode electrode and the second diode electrode; and   forming a first bridge pattern and a second bridge pattern on the first passivation pattern and the micro light emitting diode,   wherein the forming of the first passivation pattern, the micro light emitting diode, and the second passivation pattern is performed by a single mask process comprising two etching processes.

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