Package structure and method for manufacturing the same

Abstract

A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

1 . A package structure, comprising:
 a circuit board including a substrate and a first electronic element disposed on the substrate;   a mold sealing layer disposed on the substrate and covering the first electronic element, the mold sealing layer having a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface;   a conductive metal board disposed on the top surface and adjacent to the first electronic element; and   a conductive layer disposed on the side surface and electrically connected to the conductive metal board;   wherein the conductive metal board and the conductive layer are each an independent component.   
     
     
         2 . The package structure of  claim 1 , wherein the conductive layer is formed by a coating layer or a colloid. 
     
     
         3 . The package structure of  claim 1 , wherein the conductive metal board has a top face, a bottom face corresponding to the top face, and a side face connected between the top face and the bottom face, the conductive layer simultaneously abutting against the side surface and the side face, and being electrically connected to the conductive metal board. 
     
     
         4 . The package structure of  claim 3 , wherein the circuit board further includes a conductive ground element disposed on the substrate, the conductive metal board and the conductive layer being electrically connected to the conductive ground element; wherein an exposed surface is formed in the conductive ground element to expose the substrate, the conductive layer simultaneously abutting against the side surface, the side face and the exposed surface, and being electrically connected to the conductive metal board and the conductive ground element. 
     
     
         5 . The package structure of  claim 4 , wherein the conductive layer simultaneously abuts against the side surface, the side face, the top face and the exposed surface, and is electrically connected to the conductive metal board and the conductive ground element. 
     
     
         6 . The package structure of  claim 1 , wherein only the mold sealing layer is disposed between the conductive metal board and the first electronic element. 
     
     
         7 . The package structure of  claim 1 , wherein the circuit board further includes a conductive ground element, the conductive layer being electrically connected between the conductive metal board and the conductive ground element. 
     
     
         8 . The package structure of  claim 1 , wherein the conductive metal board includes a body portion and a heat dissipating portion connected to the body portion, the heat dissipating portion being disposed adjacent to the first electronic element, and a vertical projection of the heat dissipating portion onto the substrate at least partially overlapping with a vertical projection of the first electronic element onto the substrate; wherein the circuit board further includes a second electronic element disposed on the substrate, the mold sealing layer covering the second electronic element, and the first electronic element being disposed more adjacent to the conductive metal board than the second electronic element; wherein a first predetermined gap is defined between the first electronic element and the conductive metal board, and a second predetermined gap is defined between the second electronic element and the conductive metal board, the first predetermined gap being smaller than the second predetermined gap, and the first predetermined gap being smaller than 100 micrometers. 
     
     
         9 . The package structure of  claim 1 , wherein the conductive metal board includes a body portion and a heat dissipating portion connected to the body portion, and a vertical projection of the heat dissipating portion onto the substrate at least partially overlapping with a vertical projection of the first electronic element onto the substrate, wherein the conductive metal board has a bottom face adhered to the top surface of the mold sealing layer, a first predetermined distance is defined between the bottom face of the body portion and the bottom surface, and a second predetermined distance is defined between the bottom face of the heat dissipating portion to the bottom surface, the first predetermined distance being greater than the second predetermined distance. 
     
     
         10 . The package structure of  claim 9 , wherein a first predetermined gap is defined between the first electronic element and the conductive metal board, and a second predetermined gap is defined between the second electronic element and the conductive metal board, the first predetermined gap being smaller than the second predetermined gap, and the first predetermined gap being smaller than 500 micrometers. 
     
     
         11 . The package structure of  claim 1 , wherein the conductive metal board includes a body portion and a heat dissipating portion connected to the body portion, the heat dissipating portion being convex relative to the body portion, and a vertical projection of the heat dissipating portion onto the substrate at least partially overlapping with a vertical projection of the first electronic element onto the substrate, wherein the conductive metal board has a bottom face adhered to the top surface of the mold sealing layer, a third predetermined distance is defined between the bottom face of the body portion to the bottom surface, and a fourth predetermined distance is defined between the bottom face of the heat dissipating portion to the bottom surface, the third predetermined distance being smaller than the fourth predetermined distance. 
     
     
         12 . The package structure of  claim 11 , wherein a first predetermined gap is defined between the first electronic element and the conductive metal board, and a second predetermined gap is defined between the second electronic element and the conductive metal board, the first predetermined gap being smaller than the second predetermined gap, and the first predetermined gap being smaller than 500 micrometers. 
     
     
         13 . A method for manufacturing a package structure, comprising:
 providing a circuit board module, the circuit board module including a substrate component part and a plurality of first electronic elements being disposed on the substrate component part;   coating a sealing compound to the circuit board module to cover the plurality of first electronic elements;   disposing a conductive metal board module on the sealing adhesive that has not solidified;   solidifying the sealing compound to form a mold sealing structure that is combined to the conductive metal board module, the mold sealing structure covering the plurality of first electronic elements;   cutting the conductive metal board module and the mold sealing structure to form a plurality of containing grooves and expose a plurality of conductive ground elements of the substrate component part respectively from the plurality of containing grooves;   forming a conductive coating layer in the plurality of containing grooves, the conductive coating layer being electrically connected to the conductive ground element and the conductive metal board module; and   cutting the conductive coating layer apart to form a plurality of package structures.   
     
     
         14 . The method according to  claim 13 , wherein in the step of cutting the conductive metal board module and the mold sealing structure to form the plurality of containing grooves, the conductive metal board module is divided into a plurality of conductive metal board, and the mold sealing structure is divided into a plurality of mold sealing layers. 
     
     
         15 . The method according to  claim 13 , wherein the step of cutting the conductive metal board module and the mold sealing structure to form the plurality of containing grooves further includes cutting at least a portion of the substrate component part to expose the conductive ground element of the substrate component part from the containing groove. 
     
     
         16 . The method according to  claim 13 , wherein the step of forming the conductive coating layer in the plurality of containing grooves includes:
 coating a conductive layer in the plurality of containing grooves; and   solidifying the conductive layer to form the conductive coating layer.   
     
     
         17 . The method according to  claim 16 , wherein in the step of coating the conductive layer in the plurality of containing grooves, the conductive layer is coated under a vacuum environment having a predetermined vacuum pressure. 
     
     
         18 . The method according to  claim 13 , wherein the step of cutting the conductive coating layer apart to form the plurality of package structures further includes cutting the substrate component part apart; wherein the conductive coating layer is divided into a plurality of conductive layers, the substrate component part is divided into a plurality of substrates, and each of the plurality of first electronic elements is respectively disposed on each of the plurality of substrates. 
     
     
         19 . The method according to  claim 13 , wherein the conductive metal board module includes a plurality of conductive metal boards, each of the plurality of conductive metal boards respectively corresponding to each of the plurality of first electronic elements, and each of the plurality of conductive metal boards including a body portion and a heat dissipating portion connected to the body portion; wherein a vertical projection of the heat dissipating portion onto the substrate component part at least partially overlaps with a vertical projection of the first electronic element onto the substrate component part, and the heat dissipating portion is disposed more adjacent to the substrate component part than the body portion. 
     
     
         20 . A method for manufacturing a package structure, comprising:
 providing a circuit board module, the circuit board module including a substrate component part and a plurality of first electronic elements disposed on the substrate component part;   coating a sealing compound on the circuit board module to cover the plurality of first electronic elements;   disposing a plurality of conductive metal boards on the sealing compound that has not solidified;   solidifying the sealing compound to form a mold sealing structure that is combined to the conductive metal board, the mold sealing structure covering the plurality of first electronic elements;   cutting the mold sealing structure and the substrate component part to form a plurality of package structures to be coated; and   forming a conductive layer on the plurality of package structures to be coated.