Apparatus for use in electronic equipment

Abstract

Apparatus for use in electronic equipment includes a cap of nonconductive material positioned to collect and retain metallic particles produced by installation of metallic fasteners during assembly of the electronic equipment.

1 . Apparatus comprising:
 a structure configured for use in an electronic device and having an opening for receiving a fastener; and   a cap mounted on an underside of a portion of the structure at a position beneath the opening, wherein the cap is configured to capture and retain a conductive particle created by insertion of the fastener into the opening.   
     
     
         2 . The apparatus of  claim 1  wherein
 the cap has a body portion and first and second extension portions extending away from opposite sides of the body portion. 
 
     
     
         3 . The apparatus of  claim 2  wherein
 the first and second extension portions fit within respective first and second slots of the structure to retain the cap in the position beneath the opening. 
 
     
     
         4 . The apparatus of  claim 3  wherein
 the first and second slots are formed by respective first and second tabs of a planar portion of the structure bent away from the planar portion into respective first and second positions proximate the opening. 
 
     
     
         5 . The apparatus of  claim 4  wherein
 the cap includes a recessed portion positioned beneath the opening to capture and retain the conductive particle. 
 
     
     
         6 . The apparatus of  claim 5  wherein
 the opening includes a perimeter having a threaded portion to receive a threaded shaft of the fastener. 
 
     
     
         7 . The apparatus of  claim 6  wherein
 the cap comprises a non-conductive material. 
 
     
     
         8 . The apparatus of  claim 7  wherein
 the non-conductive material comprises a compressible elastic material and the first and second extension portions of the cap compress to fit into the first and second slots. 
 
     
     
         9 . Apparatus comprising:
 a shielding cover configured for attachment to a circuit board to cover and reduce an electromagnetic emission from an electronic component mounted on the circuit board;   a first region of the shielding cover having an opening allowing an end of a fastener to pass through the shielding cover for fastening a thermal dissipation component to an upper side of the shielding cover;   a second region of the shielding cover on a lower side of the shielding cover and including a portion extending away from the second side in an area proximate to the opening to form a retaining member; and   a cap of non-conductive material configured to be held in a position on the lower side of the shielding cover by the retaining member and cover the opening in the first region of the shielding cover.   
     
     
         10 . The apparatus of  claim 9  wherein
 the retaining member comprises first and second tabs of a planar portion of the shielding cover bent away from the planar portion into respective first and second positions proximate the opening to form first and second slots. 
 
     
     
         11 . The apparatus of  claim 10  wherein
 the cap has a rectangular body portion and first and second extension portions extending away from opposite sides of the body portion. 
 
     
     
         12 . The apparatus of  claim 11  wherein
 the first and second extension portions fit within respective ones of the first and second slots to retain the cap in a position beneath the opening. 
 
     
     
         13 . The apparatus of  claim 12  wherein
 the cap comprises an elastic material and the first and second extension portions formed from the elastic material compress to fit into the first and second slots. 
 
     
     
         14 . The apparatus of  claim 13  wherein
 the cap includes a recessed portion positioned beneath the opening and configured to capture and retain a metallic particle created by insertion of the fastener into the opening during assembly of the apparatus, thereby preventing the metallic particle from falling on to the circuit board. 
 
     
     
         15 . The apparatus of  claim 8  wherein
 the apparatus is configured for use in electronic equipment comprising one of one of a set top box, a gateway device, and a digital television device. 
 
     
     
         16 . The apparatus of  claim 14  wherein
 the apparatus is configured for use in electronic equipment comprising one of a set top box, a gateway device, and a digital television device.