US2021384462A1PendingUtilityA1

Sealed Structure, Light-Emitting Device, Electronic Device, And Lighting Device

Assignee: SEMICONDUCTOR ENERGY LABPriority: Nov 29, 2011Filed: Aug 19, 2021Published: Dec 9, 2021
Est. expiryNov 29, 2031(~5.3 yrs left)· nominal 20-yr term from priority
H10K 59/8792H10K 59/875H10K 59/874H10K 59/8723H10K 59/8722H10K 50/8426C03C 27/00C03C 27/06Y10T428/239B32B 17/10H01L 51/5044H01L 51/525H01L 51/5246H10K 59/122H10K 59/38H10K 50/11H05B 33/04C03C 8/00H10K 50/846H10K 50/865H10K 50/85H10K 50/131H10K 50/8428
74
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes.

Claims

exact text as granted — not AI-modified
1 . (canceled) 
     
     
         2 . A method for manufacturing a sealed structure, comprising the steps of:
 attaching a tape over a substrate;   applying a paste along a side surface of the tape;   baking the paste to from a glass layer;   disposing a counter substrate over the glass layer; and   irradiating the glass layer with laser light,   wherein the glass layer is in contact with the substrate and the counter substrate.   
     
     
         3 . The method for manufacturing a sealed structure according to  claim 2 , further comprising a step of removing the tape before the glass layer is formed. 
     
     
         4 . The method for manufacturing a sealed structure according to  claim 2 , wherein a beam diameter of the laser light is greater than or equal to a width of the glass layer.

Join the waitlist — get patent alerts

Track US2021384462A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.