Method of activating an adhesive of an ostomy appliance

Abstract

A method of applying an ostomy appliance includes providing an adhesive wafer having an adhesive layer, a backing layer applied to a distal surface of the adhesive layer, and a release liner applied to a proximal surface of the adhesive layer, where the release liner forms an enclosure; introducing liquid into the enclosure and increasing a temperature of the adhesive layer with the liquid; removing the release liner from the ostomy appliance; and applying the adhesive wafer to the skin of the user.

1 . A method of activating an adhesive of an ostomy appliance, the method comprising:
 providing an adhesive wafer for securing the ostomy appliance to skin of a user, where the adhesive wafer has an adhesive layer, a backing layer applied to a distal surface of the adhesive layer, and a release liner applied to a proximal surface of the adhesive layer, and the release liner forms an enclosure;   configuring the adhesive layer to be activated in response to an addition of liquid into the enclosure, where the adhesive layer is activated with the liquid by one of a heat transfer from the liquid to the adhesive layer and liquid contact of the liquid with the adhesive layer;   adapting the release liner for removal from the ostomy appliance; and   adapting the adhesive wafer for application to the skin of the user.   
     
     
         2 . The method of  claim 1 , wherein the addition of the liquid into the enclosure wets an absorbent wipe retained in the enclosure;
 adapting a portion of the release liner for removal from the adhesive layer and exposing the absorbent wipe;   activating the adhesive layer with the absorbent wipe and the liquid absorbed by the absorbent wipe.   
     
     
         3 . The method of  claim 1 , wherein the addition of the liquid into the enclosure wets an absorbent wipe retained in the enclosure;
 adapting a first portion of the release liner for removal from the adhesive layer and exposing the absorbent wipe;   activating the adhesive layer with the absorbent wipe and the liquid absorbed by the absorbent wipe; and   adapting a second portion of the release liner for removal from the adhesive layer.   
     
     
         4 . The method of  claim 1 , further comprising providing the adhesive wafer with calcium chloride present within the enclosure, the method further comprising:
 configuring the enclosure to receive an addition of water and allowing the water to interact with the calcium chloride and creating heat adapted to warm the adhesive layer.   
     
     
         5 . The method of  claim 1 , further comprising providing the adhesive wafer with iron oxide present within the enclosure, the method further comprising:
 configuring the enclosure to receive an addition of water and allowing the water to interact with the iron oxide and creating heat adapted to warm the adhesive layer.   
     
     
         6 . The method of  claim 1 , further comprising providing the adhesive wafer with a sachet contained in the enclosure with the sachet sealed to contain water, and further comprising rupturing the sachet contained inside of the enclosure and causing the water to flow into the enclosure. 
     
     
         7 . A method of applying an ostomy appliance, the method comprising:
 providing an adhesive wafer for securing the ostomy appliance to skin of a user, where the adhesive wafer has an adhesive layer, a backing layer applied to a distal surface of the adhesive layer, and a release liner applied to a proximal surface of the adhesive layer, and the release liner forms an enclosure;   configuring the enclosure for receiving a liquid and increasing a temperature of the adhesive layer with the liquid;   adapting the release liner for removal from the ostomy appliance; and   adapting the adhesive wafer for application to the skin of the user.   
     
     
         8 . The method of  claim 7 , further comprising providing the adhesive wafer with a sachet contained in the enclosure, with the sachet containing water, and rupturing the sachet contained in the enclosure and causing the water to flow into the enclosure. 
     
     
         9 . The method of  claim 7 , further comprising providing the adhesive wafer with calcium chloride present within the enclosure, the method further comprising:
 adapting the adhesive layer to be heated by introducing water into the enclosure and allowing the water to interact with the calcium chloride.   
     
     
         10 . The method of  claim 7 , further comprising providing the adhesive wafer with a sachet contained in the enclosure and calcium chloride contained inside of the enclosure and outside of the sachet, with the sachet containing water; the method further comprising:
 adapting the sachet contained in the enclosure to be ruptured thereby releasing the water into the enclosure causing the water to interact with the calcium chloride and heating the adhesive layer.