Method for tuning thermal expansion properties in an additive manufacturing feedstock material

Abstract

A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.

What is claimed is: 
     
         1 . A composite feedstock material for use in an additive manufacturing apparatus, the composite feedstock material comprising:
 a first material, wherein the first material is selected from the group consisting of: a plastic, a curable photopolymer system, a thermoplastic system, a polymer, a resin, a wax, a ceramic, or combinations thereof;   wherein a coefficient of thermal expansion for the first material is positive; and   a metal organic framework (MOF), wherein the MOF comprises a plurality of nodes and a plurality of linkers, the plurality of nodes coupled to the plurality of linkers, thereby forming a framework, wherein a coefficient of thermal expansion for the MOF is less than the coefficient of thermal expansion for the first material;   wherein a ratio of the first material to the MOF by weight ranges from 0.5:0.5 to 0.995:0.005.   
     
     
         2 . The composite feedstock material of  claim 1 , wherein the first material is selected from the group consisting of: acrylonitrile butadiene styrene, polylactic acid, polyvinyl alcohol, polycarbonate, curable photopolymer systems, thermoplastic systems, polymers, resins, waxes, and combinations thereof. 
     
     
         3 . The composite feedstock material of  claim 2 , wherein the first material is selected from the group consisting of: acrylonitrile butadiene styrene, polylactic acid, polyvinyl alcohol, polycarbonate, and combinations thereof. 
     
     
         4 . The composite feedstock material of  claim 1 , wherein a ratio of the first material to the MOF by weight ranges from 0.75:0.25 to 0.995:0.005. 
     
     
         5 . The composite feedstock material of  claim 1 , wherein the plurality of linkers includes one or more linkers selected from the group consisting of: H 3 BTC, H 3 TATB, H 3 HTB, H 3 TTCA, H 3 BTB, H 3 TATAB, H 3 BTE, H 6 TDPAT, H 6 TPBTM, H 3 BBC, H 6 BTEI, H 6 BTPI, H 6 PTEI, H 6 BHEI, H 5 NTEI, H 6 BTTI, H 6 BTETCA, adipic acid, H 6 TTEI, H 6 BNETPI, TIPA, H 6 BHEPI, H 2 TPDC, H 4 TpCPP-H 2 , H 4 ADIP, H 4 TTFTB, H 3 BTP, H 3 BTTri, H 3 BTT, BPD, BPDC, Py-XP, Por-PP, Py-PTP, Por-PTP, 2-5-dimethylterephtalic acid, 9,10-anthracenedicarboxylic acid, 2,3,5,6 tetramethylterephthalic acid, 1,4-napthalenedicarboxylic acid, biphenyl-4,4′-dicarboxylate, p-terphenyl-4,4′-dicarboxylic acid, triethylenediamine, 1,4-benzenedicarboxylate, and combinations thereof. 
     
     
         6 . The composite feedstock material of  claim 4 , wherein the coefficient of thermal expansion for the composite feedstock material is 0.1 to 200 ppm K −1  less than the coefficient of expansion of the first material. 
     
     
         7 . The composite feedstock material of  claim 1 , wherein the MOF has a guest molecule or atom incorporated into the framework, the guest molecule or atom selected from the group consisting of: CO 2 , N 2 , Ar, He, Ne, Kr, H 2 O, O 2  and Xe. 
     
     
         8 . The composite feedstock material of  claim 4 , wherein a coefficient of thermal expansion for the MOF ranges from −50 to 50 ppm K −1 . 
     
     
         9 . The composite feedstock material of  claim 1 , wherein the composite feedstock material is part of a microchip, a circuit board, an insulator for an electronic device, a dielectric layer for electronic potting applications, or an integrated circuit packaging. 
     
     
         10 . An electronic device comprising:
 a composite material a first material including:
 a first material, wherein a coefficient of thermal expansion for the first material is positive; and 
 a metal organic framework (MOF), wherein the MOF comprises a plurality of nodes and a plurality of linkers, the plurality of nodes coupled to the plurality of linkers, thereby forming a framework, wherein a coefficient of thermal expansion for the MOF is less than the coefficient of thermal expansion for the first material; 
 wherein a ratio of the first material to the MOF by weight ranges from 0.5:0.5 to 0.995:0.005; 
   wherein the electronic device is a microchip, a circuit board, an insulator for an electronic device, a dielectric layer for electronic potting applications, or an integrated circuit packaging.   
     
     
         11 . The electronic device of  claim 10 , wherein the first material is selected from the group consisting of: a plastic, a curable photopolymer system, a thermoplastic system, a polymer, a resin, a wax, a ceramic, or combinations thereof. 
     
     
         12 . The electronic device of  claim 11 , wherein a ratio of the first material to the MOF by weight ranges from 0.75:0.25 to 0.995:0.005. 
     
     
         13 . The electronic device of  claim 10 , wherein the MOF is selected to provide a decrease of the coefficient of thermal expansion of the composite material. 
     
     
         14 . A method for providing a metal organic framework (MOF) additive to a first material, the method comprising:
 a) selecting a target coefficient of thermal expansion, wherein the target coefficient of thermal expansion is selected to be less than a coefficient of thermal expansion of the first material;   b) providing the MOF additive, wherein the MOF additive comprises a plurality of nodes and a plurality of linkers, the plurality of nodes coupled to the plurality of linkers, thereby forming a framework;   c) obtaining a coefficient of thermal expansion for the MOF additive;   d) repeating step (b) and step (c), if necessary, until the coefficient of thermal expansion for the MOF additive is within a threshold range of the target coefficient of thermal expansion, wherein MOF additive is replaced with a different MOF additive at each repetition to select a suitable MOF additive within the threshold range; and   e) combining the first material and the suitable MOF additive to form a composite material.   
     
     
         15 . The method of  claim 14 , wherein step (b) further includes calculating an increase in energy of a linker upon compression relative to an equilibrium state of the linker using a quantum mechanical software package and selecting a linker with a lowest energetic penalty. 
     
     
         16 . The method of  claim 14 , wherein step (d) further includes replacing the MOF additive with a different MOF additive having a different plurality of nodes. 
     
     
         17 . The method of  claim 14 , wherein step (d) further includes replacing the MOF additive with a different MOF additive having a different plurality of linkers. 
     
     
         18 . The method of  claim 14 , wherein step (d) further includes replacing the MOF additive with a different MOF additive that incorporates a guest molecule into the framework of the MOF additive. 
     
     
         19 . The method of  claim 14 , wherein a ratio of the first material to the MOF by weight ranges from 0.75:0.25 to 0.995:0.005. 
     
     
         20 . The method of  claim 14 , further comprising:
 f) forming the composite material into an electronic device component.