Resin compositions and resin infusion process

Abstract

Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.

1 - 12 . (canceled) 
     
     
         13 . A curable epoxy resin composition suitable for liquid resin infusion, comprising:
 (A) only two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene represented by Formula IV:   
       
         
           
           
               
               
           
         
       
       and the other polyepoxide is a naphthalene-based epoxy having at least one naphthalene ring in its formula;
 (B) an aromatic amine curing agent selected from 9,9-bis(3-chloro-4-aminophenyl) fluorene (CAF) and 9,9-bis(4-aminophenyl)fluorene 
 (C) core-shell rubber particles. 
 
     
     
         14 . The curable epoxy resin composition of  claim 13 , wherein naphthalene-based epoxy is selected from: diglycidyl ether of 1,6-dihydroxy naphthalene; 1,7-dihydroxy naphthalene; 1 naphthalene cresol glycidyl ether; 1,2-dihydroxynaphthalene; 1,3-dihydroxynaphthalene; 1,4-dihydroxynaphthalene; 1,5-dihydroxynaphthalene; 2,3-dihydroxynaphthalene; 2,7-dihydroxynaphthalene; and combination thereof. 
     
     
         15 . The curable epoxy resin composition of  claim 13 , wherein naphthalene-based epoxy is present in an amount greater than 0% and up to 30% by weight based on the total weight of the composition. 
     
     
         16 - 18 . (canceled) 
     
     
         19 . A liquid resin infusion (LRI) manufacturing method for producing a molded article, comprising the steps of providing a fibrous preform configured to receive liquid resin, infusing the fibrous preform with the curable epoxy resin composition of  claim 13 , and curing the resin-infused preform at a curing temperature (T c ). 
     
     
         20 . The method of  claim 19 , further comprising:
 a. placing the fibrous preform in a closed mold;   b. heating the mold to an initial temperature;   c. injecting the curable epoxy resin composition into the mold so as to infuse the fibrous preform with the epoxy resin composition; and   d. curing the resin-infused preform at the curing temperature (T c ), which is higher than the initial temperature, for a time period sufficient to form a hardened article.