Stamping portions having metal flow receiving features

Abstract

An example system includes a first stamping portion having a first surface to form a corresponding stamped surface on a metal component to be stamped, and a second stamping portion having a second surface, the second surface to oppose the first surface of the first stamping portion during stamping of the metal component. The second surface includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface to attenuate an amount of metal flowing therein during stamping of the metal component between the first stamping portion and the second stamping portion.

What is claimed is: 
     
         1 . A system, comprising:
 a first stamping portion having a first surface to form a corresponding stamped surface on a metal component to be stamped; and   a second stamping portion having a second surface, the second surface to oppose the first surface of the first stamping portion during stamping of the metal component,   wherein the second surface includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface to attenuate an amount of metal flowing therein during stamping of the metal component between the first stamping portion and the second stamping portion.   
     
     
         2 . The system of  claim 1 , wherein the first stamping portion and the second stamping portion have a hardness greater than a hardness of the metal component. 
     
     
         3 . The system of  claim 1 , wherein the metal flow receiving feature includes at least one of a curved surface, a wave formation or a sawtooth formation. 
     
     
         4 . The system of  claim 3 , wherein the first surface of the first stamping portion includes a substantially flat portion. 
     
     
         5 . A system, comprising:
 a first stamping portion having a first surface, the flat surface having a substantially flat portion;   a second stamping portion having a second surface; and   a metal component positioned between the first surface of the first stamping portion and the second surface of the second stamping portion, the metal component having a stamped surface facing the first surface of the first stamping portion, the metal component having a non-stamped surface opposite the stamped surface and facing the second surface of the second stamping portion,   wherein the second surface of the second stamping portion includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface.   
     
     
         6 . The system of  claim 5 , wherein the first stamping portion and the second stamping portion have a hardness greater than a hardness of the metal component. 
     
     
         7 . The system of  claim 5 , wherein the metal flow receiving feature includes at least one of a curved surface, a wave formation or a sawtooth formation. 
     
     
         8 . The system of  claim 5 , wherein the first surface of the first stamping portion includes a substantially flat portion. 
     
     
         9 . The system of  claim 5 , wherein the metal component is a surface of an electronic device. 
     
     
         10 . The system of  claim 9 , wherein the stamped surface includes a finger recess for the surface of the electronic device. 
     
     
         11 . A method, comprising:
 positioning a metal component between a first stamping portion and a second stamping portion, the metal component having a stamped surface to be stamped and a non-stamped surface opposite the stamped surface, the first stamping portion having a first surface facing the stamped surface of the metal component, the second stamping portion having a second surface facing the non-stamped surface of the metal component, the second surface of the second stamping portion including a metal flow receiving feature;   stamping the metal component between the first stamping portion and the second stamping portion, the stamping including flowing material from the metal component into the metal flow feature.   
     
     
         12 . The method of  claim 11 , wherein the first stamping portion and the second stamping portion have a hardness greater than a hardness of the metal component. 
     
     
         13 . The method of  claim 11 , wherein the first surface of the first stamping portion includes a substantially flat portion. 
     
     
         14 . The method of  claim 11 , wherein the first surface of the first stamping portion includes a substantially flat portion. 
     
     
         15 . The method of  claim 11 , wherein the stamped surface of the metal component includes a finger tab for a surface of an electronic device.