Method for Manufacturing an Environment-Friendly Heat Shielding Film Using a Non-Radioactive Stable Isotope

Abstract

A method for manufacturing an environmental-friendly heat shielding film using a non-radioactive stable isotope includes: a substrate layer providing step of providing a substrate layer; and a heat shielding layer forming step of, after the substrate layer providing step, forming, on one surface of the substrate layer, a heat shielding layer containing a non-radioactive stable isotope tungsten bronze compound that does not emit radiation.

What is claimed is: 
     
         1 . A method for manufacturing an environmental-friendly heat shielding film using a non-radioactive stable isotope, the method comprising:
 a substrate layer providing step of providing a substrate layer; and   a heat shielding layer forming step of, after the substrate layer providing step, forming, on one surface of the substrate layer, a heat shielding layer containing a non-radioactive stable isotope tungsten bronze compound that does not emit radiation.   
     
     
         2 . The method of  claim 1 , wherein the non-radioactive stable isotope tungsten bronze compound is deficient in oxygen. 
     
     
         3 . The method of  claim 2 , wherein the non-radioactive stable isotope tungsten bronze compound forms a  (Y) A x   (182,183,184,186) WO (3-n)  type hexagonal structure, wherein
 the  (Y) A is a non-radioactive stable isotope;   the X is the number of elements doped to the  (Y) A according to reduction calcination;   the Y is a mass number of A; and   the (3-n) is lack of oxygen.   
     
     
         4 . The method of  claim 3 , wherein the  (Y) A is a non-radioactive alkali metal element or a non-radioactive alkali earth metal element. 
     
     
         5 . The method of  claim 4 , wherein the  (Y) A is any one of  (23) Na,  (39,41) K,  (85) Rb,  (133) Cs,  (24,25,26) Mg, and  (42,43,44) Ca. 
     
     
         6 . The method of  claim 3 , wherein the heat shielding layer forming step comprises:
 a non-radioactive compound forming step of forming a non-radioactive stable isotope tungsten bronze compound;   a passivation film forming step of, after the non-radioactive compound forming step, forming a passivation film on the non-radioactive stable isotope tungsten bronze compound; and   a coating step of, after the passivation film forming step, forming a coating film on the substrate layer.   
     
     
         7 . The method of  claim 6 , wherein the non-radioactive compound forming step comprises:
 a synthesizing step of synthesizing a non-radioactive stable isotope tungsten bronze hydrate by liquid precipitation;   a primary calcining step of, after the synthesizing step, calcining the non-radioactive stable isotope tungsten bronze hydrate in the range of 300-600° C. to remove hydroxyl groups and water molecules and to form an amorphous form; and   a secondary reduction firing step of, after the primary calcining step, carrying out reduction firing under the introduction of an inert gas in order to form an oxygen-deficient  (Y) A x   (182,183,184,186)  W 1 O (3-n)  type hexagonal structure.   
     
     
         8 . The method of  claim 6 , wherein the passivation film forming step comprises:
 an organic acid metal chelate compound preparing step of preparing an organic acid metal chelate compound; and   a dispersed sol forming step of, after the organic acid metal chelate compound preparing step, forming a dispersed sol.   
     
     
         9 . The method of  claim 8 , wherein in the organic acid metal chelate compound preparing step, a precursor containing a transition metal is dissolved in an organic acid solvent, and refluxed by agitation at 60-80° C. for 4-5 hours. 
     
     
         10 . The method of  claim 8 , wherein in the dispersed sol forming step, a dispersed sol containing 20-30 wt % of a non-radioactive stable isotope tungsten bronze compound, 1-10 wt % of a dispersant, and 5-10 wt % of an organic acid metal chelate compound is formed. 
     
     
         11 . The method of  claim 6 , wherein the coating step comprises:
 a coating sol forming step of forming a coating sol;   a coating sol applying step of, after the coating sol forming step, applying the coating sol on the substrate layer;   a drying and curing step of, after the coating sol applying step, subjecting the substrate layer having the coating sol applied thereto to hot-air drying and ultraviolet curing.   
     
     
         12 . The method of  claim 11 , wherein in the coating sol forming step, a coating sol containing 40-50 wt % of a dispersed sol, 40-50 wt % of a binder, and 10-20 wt % of an organic solvent is formed. 
     
     
         13 . The method of  claim 12 , wherein the binder is a photopolymer and contains an oligomer, a monomer; and a photo-initiator, which induce photo-polymerization by ultraviolet irradiation. 
     
     
         14 . The method of  claim 12 , wherein the organic solvent includes at least one of methyl ethyl ketone, toluene, ethyl acetate, iso-propyl alcohol, ethyl cellosolve, iso-butyl alcohol, dimethylformamide, ethanol, butyl cellosolve, xylene, 1-octanol, and diethylene glycol, nitrobenzene. 
     
     
         15 . The method of  claim 11 , wherein in the coating sol applying step, any one of micro gravure coating, knife coating, and roll-to-roll coating is used. 
     
     
         16 . The method of  claim 11 , wherein in the coating sol applying step, the thickness of a coating film is 3-4 μm. 
     
     
         17 . The method of  claim 1 , further comprises an adhesive layer forming step of, after the heat shielding layer forming step, forming an adhesive layer on one surface of the heat shielding layer. 
     
     
         18 . The method of  claim 17 , further comprises a release paper attaching step of, after the adhesive layer forming step, attaching a release paper on one surface of the adhesive layer.