Catalyst ink for plating and electroless plating method using same

Abstract

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

1 . A catalyst ink for plating, comprising:
 a polymer binder;   a metal ion as a catalyst;   a coupling agent for coupling the metal ion and the polymer; and   a solvent,   wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system.   
     
     
         2 . The catalyst ink of  claim 1 , wherein the lower critical solution temperature is 30° C. or higher. 
     
     
         3 . The catalyst ink of  claim 1 , wherein the lower critical solution temperature is 50° C. or higher. 
     
     
         4 . The catalyst ink of  claim 1 , wherein the lower critical solution temperature is 55° C. or higher. 
     
     
         5 . The catalyst ink of  claim 1 , wherein the lower critical solution temperature is 60° C. or higher. 
     
     
         6 . The catalyst ink of  claim 1 , wherein the lower critical solution temperature is 65° C. or higher. 
     
     
         7 . The catalyst ink of  claim 1 , wherein the solvent is water, alcohol, or acetone. 
     
     
         8 . The catalyst ink of  claim 3 , wherein the polymer comprises an OH functional group. 
     
     
         9 . The catalyst ink of  claim 3 , wherein the polymer comprises at least one selected from the group consisting of hydroxypropyl cellulose, methyl cellulose, hydroxypropylmethyl cellulose, ethyl(hydroxyethyl)cellulose, poly(N-isopropylacrylamide-co-acrylic acid) and poly(propylene glycol). 
     
     
         10 . The catalyst ink of  claim 1 , wherein the metal of the metal ion is at least one selected from the group consisting of Ag, Fe, Co, Ni, Cu, Pd, Pt, Sn, and Au. 
     
     
         11 . The catalyst ink of  claim 1 , wherein the ink has a viscosity of 5 mPa·s to 1,500 mPa·s. 
     
     
         12 . The catalyst ink of  claim 1 , wherein the ink has a loss modulus higher than a storage modulus. 
     
     
         13 . A plating method comprising:
 providing a base material in which a precursor pattern is formed by ejecting a catalyst ink for plating, comprising a polymer binder, a metal ion as a catalyst, and a solvent; and   forming a plated pattern by immersing the base material in which the precursor pattern is formed in a plating solution which is maintained at a temperature equal to or higher than a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system for electroless plating.   
     
     
         14 . The plating method of  claim 13 , wherein the solvent is water, and
 the polymer comprises at least one selected from the group consisting of hydroxypropyl cellulose, methyl cellulose, hydroxypropylmethyl cellulose, ethyl(hydroxyethyl)cellulose, poly(N-isopropylacrylamide-co-acrylic acid) and poly(propylene glycol).   
     
     
         15 . The plating method of  claim 13 , wherein the lower critical solution temperature is 30° C. or higher. 
     
     
         16 . The plating method of  claim 13 , wherein the lower critical solution temperature is 50° C. or higher. 
     
     
         17 . The plating method of  claim 13 , wherein in the providing of the base material, the catalyst ink for plating is ejected without pressure through a nozzle. 
     
     
         18 . The plating method of  claim 17 , wherein the catalyst ink for plating has a loss modulus higher than a storage modulus.