Local polishing method, local polishing device, and corrective polishing apparatus using the local polishing device

Abstract

Provided is a local polishing technique suitable for corrective polishing. Press polishing is performed while supplying a polishing solution between a work and a work-polishing rotating tool locally pressed against the work, the polishing solution having abrasive grains composed of organic particles with an average particle size of 5 μm or more dispersed in a liquid. The rotating tool is made of an elastic material.

1 : A local polishing method comprising press polishing performed while supplying a polishing solution between a work and a work-polishing rotating tool locally pressed against the work, the polishing solution having abrasive grains composed of organic particles with an average particle size of 5 μm or more dispersed in a liquid. 
     
     
         2 : The local polishing method according to  claim 1 , wherein the rotating tool is made of an elastic material. 
     
     
         3 : The local polishing method according to  claim 1 , wherein the liquid is pure water or a liquid containing water as a main component. 
     
     
         4 : The local polishing method according to  claim 1 , wherein the rotating tool comprises:
 a rotating body;   a shaft body that has a tip end provided with the rotating body and is long in an axial direction around which the rotating body is rotated; and   a rotation support portion that supports the shaft body on a base end side thereof for allowing the shaft body to rotate around an axis center thereof, and   the rotating body is pressed, at an outer circumferential surface thereof, against the work to curve the shaft body, and elastic restoring force of the curved shaft body causes the rotating body to be pressed and urged against the work.   
     
     
         5 : The local polishing method according to  claim 1 , wherein an outer diameter of a polishing action region on an outer circumferential surface of a rotating tool, the outer circumferential surface facing the work, is set to 5.0 mm or less. 
     
     
         6 : The local polishing method according to  claim 1 , wherein the organic particles are acrylic particles or urethane particles. 
     
     
         7 : A local polishing device comprising:
 a work-polishing rotating tool locally pressed against a work; and   machining solution supply section that supplies, between the rotating tool and the work, a polishing solution in which abrasive grains composed of organic particles with an average particle size of 5 μm or more are dispersed in a liquid.   
     
     
         8 : The local polishing device according to  claim 7 , wherein the rotating tool is made of an elastic material. 
     
     
         9 : The local polishing device according to  claim 7 , wherein the liquid is pure water or a liquid containing water as a main component. 
     
     
         10 : The local polishing device according to  claim 7 , wherein the rotating tool comprises:
 a rotating body;   a shaft body that has a tip end provided with the rotating body and is long in an axial direction around which the rotating body is rotated; and   a rotation support portion that supports the shaft body on a base end side thereof for allowing the shaft body to rotate around an axis center thereof, and   the rotating body is pressed, at an outer circumferential surface thereof, against the work to curve the shaft body, and elastic restoring force of the curved shaft body causes the rotating body to be pressed and urged against the work.   
     
     
         11 : The local polishing device according to  claim 7 , wherein an outer diameter of a polishing action region on an outer circumferential surface of a rotating tool, the outer circumferential surface facing the work, is 5.0 mm or less. 
     
     
         12 : The local polishing device according to  claim 7 , wherein the organic particles are acrylic particles or urethane particles. 
     
     
         13 : A corrective polishing device, wherein the local polishing device according to  claim 7  is used.