MEMS-Sensor

Abstract

A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

What is claimed is: 
     
         1 . A MEMS sensor comprising:
 a housing with an interior volume, wherein the housing comprises an access port to the interior volume;   a MEMS component affixed to an interior surface of the housing, wherein a central portion of the MEMS component is over the access port; and   a protection structure affixed to an exterior surface of the housing, wherein a central portion of the protection structure is under the access port.   
     
     
         2 . The MEMS sensor of  claim 1 , wherein the protection structure comprises a protection layer. 
     
     
         3 . The MEMS sensor of  claim 1 , wherein the protection structure comprises a plastic or a silicone material. 
     
     
         4 . The MEMS sensor of  claim 1 , further comprising first and second contact connector areas affixed to an exterior surface of the housing. 
     
     
         5 . The MEMS sensor of  claim 1 , further comprising an integrated circuit device affixed to an interior surface of the housing, wherein the integrated circuit device is electrically coupled to the MEMS component. 
     
     
         6 . The MEMS sensor of  claim 5 , wherein the MEMS component and the integrated circuit device are both affixed to a substrate of the housing. 
     
     
         7 . The MEMS sensor as claimed in  claim 5 , wherein the integrated circuit device comprises a glop-top material layer. 
     
     
         8 . A MEMS sensor comprising:
 a housing with an interior volume, wherein the housing comprises a first access port to the interior volume;   a MEMS component affixed to an interior surface of the housing, wherein a central portion of the MEMS component is over the first access port;   a carrier board affixed to an exterior surface of the housing, wherein the carrier board comprises a second access port under the first access port; and   a protection structure affixed to a top surface of the carrier board, wherein a central portion of the protection structure is under the first access port and over the second access port.   
     
     
         9 . The MEMS sensor of  claim 8 , wherein the protection structure comprises a protection layer. 
     
     
         10 . The MEMS sensor of  claim 8 , wherein the protection structure comprises a plastic or a silicone material. 
     
     
         11 . The MEMS sensor of  claim 8 , further comprising first and second contact connector areas affixed between the housing and the carrier board. 
     
     
         12 . The MEMS sensor of  claim 8 , further comprising an integrated circuit device affixed to an interior surface of the housing, wherein the integrated circuit device is electrically coupled to the MEMS component. 
     
     
         13 . The MEMS sensor of  claim 12 , wherein the MEMS component and the integrated circuit device are both affixed to a substrate of the housing. 
     
     
         14 . The MEMS sensor as claimed in  claim 12 , wherein the integrated circuit device comprises a glop-top material layer. 
     
     
         15 . A MEMS sensor comprising:
 a housing with an interior volume, wherein the housing comprises an access port to the interior volume;   a MEMS component affixed to an interior surface of the housing, wherein a central portion of the MEMS component is over the access port; and   a protection structure partially embedded in the housing, wherein the protection structure extends across the access port.   
     
     
         16 . The MEMS sensor of  claim 1 , wherein the protection structure comprises a protection layer. 
     
     
         17 . The MEMS sensor of  claim 1 , wherein the protection structure comprises a plastic or a silicone material. 
     
     
         18 . The MEMS sensor of  claim 1 , further comprising first and second contact connector areas affixed to an exterior surface of the housing. 
     
     
         19 . The MEMS sensor of  claim 1 , further comprising an integrated circuit device affixed to an interior surface of the housing, wherein the integrated circuit device is electrically coupled to the MEMS component, and wherein the integrated circuit device comprises a glop-top material layer. 
     
     
         20 . The MEMS sensor of  claim 5 , wherein the MEMS component and the integrated circuit device are both affixed to a substrate of the housing.