Chemical-mechanical polishing pad with protruded structures

Abstract

A polishing pad includes a supporting layer and a protruded pattern disposed on the supporting layer. The protruded pattern includes a horizontal extended surface and a vertical side surface. Further, the supporting layer includes a first supporting layer and a second supporting layer, and the first supporting layer is disposed on the second supporting layer. In particular, a variation of a horizontal cross-sectional area of the protruded pattern is equal to or less than 50% along a protrusion direction.

1 . A polishing pad comprising:
 a supporting layer; and   a protruded pattern disposed on the supporting layer,   wherein the protruded pattern includes a horizontal extended surface and a vertical side surface.   
     
     
         2 . The polishing pad of  claim 1 , wherein the supporting layer comprises:
 a first supporting layer; and   a second supporting layer,   wherein the first supporting layer is disposed on the second supporting layer.   
     
     
         3 . The polishing pad of  claim 1 , wherein a variation of a horizontal cross-sectional area of the protruded pattern is equal to or less than 50% along a protrusion direction. 
     
     
         4 . The polishing pad of  claim 1 , wherein an area ratio of the extended surface to the polishing pad is equal to or greater than 1% and equal to or less than 80%. 
     
     
         5 . The polishing pad of  claim 1 , wherein the protruded pattern includes a plurality of unit patterns separately disposed from each other. 
     
     
         6 . The polishing pad of  claim 1 , wherein the protruded pattern includes a plurality of unit patterns laterally connected with each other. 
     
     
         7 . The polishing pad of  claim 1 , wherein a total peripheral length of the extended surface within a 1 cm 2  unit area of the polishing pad is equal to or greater than 24 cm and equal to or less than 2400 cm. 
     
     
         8 . The polishing pad of  claim 1 , wherein a height of the protruded pattern is equal to or greater than 10 μm and equal to or less than 1000 μm. 
     
     
         9 . The polishing pad of  claim 2 , wherein the supporting layer includes a first groove formed in the first supporting layer, the first groove dividing the supporting layer into a plurality of sections. 
     
     
         10 . The polishing pad of  claim 9 , wherein a remaining thickness of the first supporting layer under the first groove is equal to or less than 500 μm. 
     
     
         11 . The polishing pad of  claim 2 , wherein a thickness of the first supporting layer is equal to or less than 1500 μm, and
 wherein a thickness of the second supporting layer is equal to or greater than 100 μm and equal to or less than 3000 μm. 
 
     
     
         12 . The polishing pad of  claim 9 , wherein the supporting layer includes a second groove formed within the first groove, and
 wherein a width of the second groove is narrower than a width of the first groove.   
     
     
         13 . The polishing pad of  claim 1 , wherein the supporting layer includes a groove dividing the supporting layer into a plurality of sections. 
     
     
         14 . The polishing pad of  claim 2 , wherein the first supporting layer includes a first material, and the second supporting layer includes a second material, and
 wherein a hardness of the first material is equal to or greater than a hardness of the second material.   
     
     
         15 . The polishing pad of  claim 1 , wherein the protruded pattern includes a first material, and the supporting layer includes a second material, and
 wherein a hardness of the first material is equal to or greater than a hardness of the second material.   
     
     
         16 . The polishing pad of  claim 2 , wherein the second supporting layer includes a foam material having a porosity. 
     
     
         17 . The polishing pad of  claim 14 , wherein the first hardness is equal to or greater than Shore 30D and equal to or less than Shore 80D, and
 wherein the second hardness is equal to or greater than Shore 20A and equal to or less than Shore 80A.   
     
     
         18 . The polishing pad of  claim 17 , wherein at least one of the first material or the second material is selected from the group consisting of polyurethane, polybutadiene, polycarbonate, polyoxymethylene, polyamide, epoxy, acrylonitrile butadiene styrene copolymer, polyacrylate, polyetherimide, acrylate, polyalkylene, polyethylene, polyester, natural rubber, polypropylene, polyisoprene, polyalkylene oxide, polyethylene oxide, polystyrene, phenolic resin, amine, urethane, silicone, acrylate, fluorene, phenylene, pyrene, azulene, naphthalene, acetylene, p-phenylene vinylene, pyrrole, carbazole, indole, azepine, aniline, thiophene, 3,4-ethylenedioxysiphen, and p-phenylene sulfide. 
     
     
         19 . The polishing pad of  claim 15 , wherein the first hardness is equal to or greater than Shore 30D and equal to or less than Shore 80D, and
 wherein the second hardness is equal to or greater than Shore 20A and equal to or less than Shore 80A.   
     
     
         20 . The polishing pad of  claim 19 , wherein at least one of the first material or the second material is selected from the group consisting of polyurethane, polybutadiene, polycarbonate, polyoxymethylene, polyamide, epoxy, acrylonitrile butadiene styrene copolymer, polyacrylate, polyetherimide, acrylate, polyalkylene, polyethylene, polyester, natural rubber, polypropylene, polyisoprene, polyalkylene oxide, polyethylene oxide, polystyrene, phenolic resin, amine, urethane, silicone, acrylate, fluorene, phenylene, pyrene, azulene, naphthalene, acetylene, p-phenylene vinylene, pyrrole, carbazole, indole, azepine, aniline, thiophene, 3,4-ethylenedioxysiphen, and p-phenylene sulfide. 
     
     
         21 . The polishing pad of  claim 15 , wherein the first material includes an additive to enhance hardness and/or wear resistance. 
     
     
         22 . The polishing pad of  claim 21 , wherein the additive includes Teflon, graphene, carbon nanoparticles, or any combination thereof. 
     
     
         23 . The polishing pad of  claim 15 , wherein the first material includes a coating material to enhance wear resistance. 
     
     
         24 . The polishing pad of  claim 23 , wherein the coating material includes Teflon, boron nitride, carbon nanotube, or any combination thereof.