Shoe, sole, and insole with foam extending through insole board

Abstract

Disclosed are shoes, soles, and insoles with foam extending through the insole board, and processes for manufacturing them. In one embodiment, the insole includes a board having an upper surface, a lower surface, and a hole extending from the upper surface to the lower surface; and a foam pad adhered to the upper surface of the board, the foam pad extending into the hole.

1 . An insole for a shoe, the insole comprising:
 a board having an upper surface, a lower surface, and a hole extending from the upper surface to the lower surface; and   a foam pad adhered to the upper surface of the board, the foam pad extending into the hole.   
     
     
         2 . The insole of  claim 1 , wherein the foam protrudes through the hole, and below the lower surface of the board. 
     
     
         3 . The insole of  claim 1 , wherein the foam adheres directly to the upper surface of the board. 
     
     
         4 . The insole of  claim 1 , wherein the foam pad includes a plurality of second holes therethrough, the second holes being arranged near an edge of the hole in the board. 
     
     
         5 . The insole of  claim 1 , wherein the foam pad comprises an open-cell polyether foam. 
     
     
         6 . The insole of  claim 1 , wherein the hole is located where a ball of a wearer's foot would rest. 
     
     
         7 . The insole of  claim 1 , wherein the foam pad includes a heel bump located where a heel of a wearer's foot would rest. 
     
     
         8 . The insole of  claim 1 , wherein the foam pad comprises:
 an arch support.   
     
     
         9 . A sole for a shoe, the sole comprising:
 the insole of  claim 1 ; and   an outsole.   
     
     
         10 . A shoe, comprising:
 the insole of  claim 1 ;   an outsole; and   an upper.   
     
     
         11 . A process for making an insole for a shoe, the process comprising:
 placing a board in a mold, the board having an upper surface, a lower surface, and a hole extending from the upper surface to the lower surface; and   injecting liquid foam onto the board such that the liquid foam flows into the hole.   
     
     
         12 . The process of  claim 11 , further comprising:
 injecting the liquid foam onto the board such that the liquid foam flows through the hole, and below the lower surface of the board.   
     
     
         13 . The process of  claim 11 , wherein injecting the liquid foam onto the board comprises:
 injecting the liquid foam directly onto the board.   
     
     
         14 . The process of  claim 11 , further comprising:
 closing the mold subsequent to injecting the liquid foam, wherein the liquid foam solidifies inside the mold;   opening the mold subsequent to closing the mold and subsequent to the liquid foam solidifying; and   removing the insole from the mold.   
     
     
         15 . The process of  claim 11 , wherein the liquid foam comprises an open-cell polyether foam.