Method of manufacturing circuit board structure

Abstract

A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.

What is claimed is: 
     
         1 . A method of manufacturing a circuit board structure, comprising:
 providing a carrier board comprising a release layer;   forming a stopper over the carrier board;   disposing an adhesive layer over the carrier board;   abutting a conductive bump of an electronic component against the stopper and placing the electronic component over the carrier board;   performing a build-up process; and   removing the carrier board.   
     
     
         2 . The method of manufacturing the circuit board structure of  claim 1 , wherein the electronic component comprises a chip, the chip has a first surface and a second surface that are oppositely disposed, and the conductive bump is located on the second surface, wherein the build-up process comprises:
 forming a plurality of dielectric layers and circuits in the dielectric layers over the first surface of the chip.   
     
     
         3 . The method of manufacturing the circuit board structure of  claim 2 , further comprising forming an outer layer over the second surface of the chip and the conductive bump, and the outer layer comprises:
 an insulating layer;   a via within the insulating layer and electrically connected to the conductive bump; and   a patterned circuit layer disposed over the insulating layer and electrically connected to the via.   
     
     
         4 . The method of manufacturing the circuit board structure of  claim 1 , wherein the abutting the conductive bump of the electronic component against the stopper and placing the electronic component over the carrier board comprises:
 abutting the conductive bump against a first portion of the stopper; and   abutting the conductive bump against a second portion of the stopper, wherein the second portion is perpendicular to the first portion.   
     
     
         5 . The method of manufacturing the circuit board structure of  claim 1 , wherein the disposing the adhesive layer over the carrier board comprises: covering the stopper with the adhesive layer.