Particle reduction during sputtering deposition

Abstract

Described herein are apparatuses and methods for holding a substrate in a position that minimizes particle contamination of the substrate when the substrate is being coated. Along with the apparatus, processes for reducing particle reduction on substrates are provided. The articles and processes described herein are useful in making coated glass substrates, such as used in electrochromic, photochromic, or photovoltaic technologies.

1 . An article comprising:
 a carrier for holding a substrate in an approximately vertical configuration, the substrate having at least a front face, a back face, a top edge, a bottom edge, and two lateral edges, the carrier comprising:
 a. a frame that is dimensionally larger than the substrate, the frame comprising:
 i. a top section comprising at least one edge and positioned to contact, or indirectly or directly support at least part of the top edge, the front face or the back face of the substrate;
 A. wherein the top section comprises one or more collection trays, the one or more collection trays comprise a finned object having a length, a width, and a thickness, that protrudes from the top section at an angle θ of from about 20° to about 160° relative to the top section, and wherein the length of the finned object spans at least part of the length of the top section and is approximately parallel to the at least one edge of the top section; 
 
 ii. a bottom section approximately parallel to the top section, the bottom section positioned to contact, or indirectly or directly support at least part of the bottom edge, the front face or the back face of the substrate; and 
 iii. two lateral sections approximately parallel to each other and approximately orthogonal to the top and bottom sections, each lateral section positioned to contact, or indirectly or directly support at least part of one of the lateral edges, or the front face or the back face of the substrate; 
 
 b. one or more clamping mechanisms for fixing the glass to at least one of the top, bottom, or lateral sections of the frame; and 
   wherein the carrier is designed so that when a substrate is in the carrier, the substrate is held at an angle φ of from greater than 0° to about 10° forward tilt.   
     
     
         2 . A method of coating a substrate comprising:
 a. placing the substrate in the article, comprising:
 a carrier for holding a substrate in an approximately vertical configuration, the substrate having at least a front face, a back face, a top edge, a bottom edge, and two lateral edges, the carrier comprising: 
   a frame that is dimensionally larger than the substrate, the frame comprising:
 a top section comprising at least one edge and positioned to contact, or indirectly or directly support at least part of the top edge, the front face or the back face of the substrate; 
 wherein the top section comprises one or more collection trays, the one or more collection trays comprise a finned object having a length, a width, and a thickness, that protrudes from the top section at an angle θ of from about 20° to about 160° relative to the top section, and wherein the length of the finned object spans at least part of the length of the top section and is approximately parallel to the at least one edge of the top section; 
   a bottom section approximately parallel to the top section, the bottom section positioned to contact, or indirectly or directly support at least part of the bottom edge, the front face or the back face of the substrate; and   two lateral sections approximately parallel to each other and approximately orthogonal to the top and bottom sections, each lateral section positioned to contact, or indirectly or directly support at least part of one of the lateral edges, or the front face or the back face of the substrate;   
       one or more clamping mechanisms for fixing the glass to at least one of the top, bottom, or lateral sections of the frame; and
 wherein the carrier is designed so that when a substrate is in the carrier, the substrate is held at an angle φ of from greater than 0° to about 10° forward tilt; and
 b. subjecting the substrate to a thin-film coating process. 
 
 
     
     
         3 . The method of  claim 1 , wherein the thin film coating process comprises chemical vapor deposition, sputtering deposition, electron beam deposition, pulsed laser deposition, molecular beam epitaxy, or ion beam deposition. 
     
     
         4 . The method of  claim 11 , wherein the substrate is held at an angle φ of from greater than about 1° to about 5° forward tilt. 
     
     
         5 . The method of  claim 1 , wherein the finned object protrudes from the top section at an angle θ of from about 40° to about 140° relative to the top section. 
     
     
         6 . The method of  claim 1 , wherein the angle of the finned object relative to the top section changes from the initial angle θ to a final angle, ψ. 
     
     
         7 . The method of  claim 5 , wherein the change in angle is due to a curve or a bend and is the difference between θ and ψ is greater than 60°. 
     
     
         8 . The method of  claim 1 , wherein the top section of the frame is in front of the front face of the substrate and has a tilt, ω, of from −10° to 10°. 
     
     
         9 . The method of  claim 1 , wherein the top section of the frame is behind of the front face of the substrate and has a forward tilt, ω, of from −10° to 10°. 
     
     
         10 . The method of  claim 1 , wherein the frame further comprises one or more electrolytic coating layers. 
     
     
         11 . The method of  claim 9 , wherein the electrolytic coating layer comprises copper, chromium, titanium, nickel, or combinations or oxides thereof.