Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching
Abstract
A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater thanFDπw0,2λ,where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A glass article comprising:
a glass substrate having a first major surface and a second major surface opposite the first major surface and separated from the first major surface by a thickness; and a plurality of apertures extending through the glass substrate from the first major surface to the second major surface, wherein:
each of the plurality of apertures has an average diameter of greater than or equal to 5 μm and less than or equal to 20 μm; and
an aspect ratio of the average thickness of the glass substrate to the average diameter of the plurality of apertures is greater than or equal to 20:1.
2 . The glass article according to claim 1 , wherein the aspect ratio is greater than or equal to 30:1.
3 . The glass article according to claim 1 , wherein the aspect ratio is greater than or equal to 40:1.
4 . The glass article according to claim 1 , wherein a difference between a diameter at the first major surface of each of the plurality of apertures and a diameter at a distance of half of the average thickness of the glass substrate from the first major surface of each of the plurality of apertures is less than or equal to 30%.
5 . The glass article according to claim 1 , wherein the glass article comprises high purity fused silica.
6 . The glass article according to claim 1 , wherein the glass article comprises borosilicate glass.
7 . The glass article according to claim 1 , wherein the glass article comprises a glass having a silica content of greater than or equal to 95 mol %.Join the waitlist — get patent alerts
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