Thermal control for electronic devices

Abstract

A method for temperature control. In some embodiments, the method includes sensing a first temperature of an electronic device, determining that the first temperature exceeds a first threshold, and increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device. The increasing of the power may include increasing the power in response to determining that the first temperature exceeds the first threshold.

what is claimed is: 
     
         1 . A method for temperature control, the method comprising:
 sensing a first temperature of an electronic device;   determining that the first temperature exceeds a first threshold; and   increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device,   wherein the increasing of the power comprises increasing the power in response to determining that the first temperature exceeds the first threshold.   
     
     
         2 . The method of  claim 1 , wherein:
 the power supplied to the thermoelectric cooler is an average power supplied to the thermoelectric cooler; and   the increasing of the power comprises modifying a duty cycle of a pulse-width-modulated drive current applied to the thermoelectric cooler.   
     
     
         3 . The method of  claim 1 , further comprising sensing a second temperature of the electronic device. 
     
     
         4 . The method of  claim 3 , further comprising:
 determining that the second temperature is equal to or less than the first threshold;   determining that the second temperature is within a tolerance temperature range; and   decreasing the power supplied to the thermoelectric cooler.   
     
     
         5 . The method of  claim 3 , further comprising:
 determining that the second temperature is equal to or less than the first threshold;   determining that the second temperature is outside a tolerance temperature range; and   decreasing the power supplied to the thermoelectric cooler to a power level at most approximately equal to a first power level.   
     
     
         6 . The method of  claim 5 , further comprising sensing a third temperature of the electronic device. 
     
     
         7 . The method of  claim 6 , further comprising:
 determining that the third temperature is within the tolerance temperature range; and   sensing a fourth temperature of the electronic device.   
     
     
         8 . The method of  claim 3 , further comprising:
 determining that the second temperature exceeds the first threshold;
 determining that: 
 the power supplied to the thermoelectric cooler is at a drive limit, or a third temperature is less than a second threshold; and 
   limiting an activity rate of the electronic device,   wherein the second threshold is based on a first humidity.   
     
     
         9 . The method of  claim 8 , further comprising:
 sensing the first humidity; and   determining a dew point based on the first humidity,   wherein the second threshold is based on the dew point.   
     
     
         10 . The method of  claim 8 , wherein the third temperature is the second temperature. 
     
     
         11 . The method of  claim 8 , further comprising sensing the third temperature, wherein:
 the sensing of the second temperature comprises sensing the second temperature with a first temperature sensor; and   the sensing of the third temperature comprises sensing the third temperature with a second temperature sensor different from the first temperature sensor.   
     
     
         12 . The method of  claim 1 , wherein the electronic device is a central processing unit. 
     
     
         13 . The method of  claim 1 , wherein the sensing of the first temperature of the electronic device comprises sensing a temperature of a controller of a solid state drive. 
     
     
         14 . The method of  claim 1 , wherein the sensing of the first temperature of the electronic device comprises sensing a temperature of a memory component of a solid state drive. 
     
     
         15 . A system, comprising:
 a processing circuit;   a memory; and   a first thermoelectric cooler,   the memory storing instructions that, when executed by the processing circuit, cause the processing circuit to:   cause a temperature sensor to sense a first temperature of a first solid state drive;   determine that the first temperature exceeds a first threshold; and   cause a first drive circuit to increase a power supplied to the first thermoelectric cooler, the first thermoelectric cooler being thermally connected to the first solid state drive.   
     
     
         16 . The system of  claim 15 , wherein the system comprises a first rack comprising:
 the first solid state drive; and   a second solid state drive, different from the first solid state drive,   wherein the instructions further cause the processing circuit to cause a second drive circuit to increase a power supplied to a second thermoelectric cooler thermally connected to the second solid state drive.   
     
     
         17 . The system of  claim 16 , wherein the system further comprises a second rack comprising:
 a third solid state drive,   wherein the instructions further cause the processing circuit to cause a third drive circuit to maintain a power supplied to a third thermoelectric cooler thermally connected to the third solid state drive.   
     
     
         18 . The system of  claim 15 , wherein the instructions further cause the processing circuit to cause the temperature sensor to sense a second temperature of the first solid state drive. 
     
     
         19 . The system of  claim 18 , wherein the instructions further cause the processing circuit to:
 determine that the second temperature is equal to or less than the first threshold;   determine that the second temperature is within a tolerance temperature range; and   the first drive circuit to decrease the power supplied to the first thermoelectric cooler.   
     
     
         20 . A system, comprising:
 means for processing;   a memory; and   a first thermoelectric cooler,   memory storing instructions that, when executed by the means for processing, cause the means for processing to:   sense a first temperature of a first solid state drive;   determine that the first temperature exceeds a first threshold; and   increase a power supplied to the first thermoelectric cooler, the first thermoelectric cooler being thermally connected to the first solid state drive.