Molded pocket in transaction card construction

Abstract

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

What is claimed is: 
     
         1 . A method of manufacturing an object, the method comprising:
 forming an object frame within a mold, wherein forming the object frame includes:   placing heated material on a first plate, wherein the first plate is in contact with a first surface of the heated material;   placing a second plate on a second surface of the heated material, wherein the second plate includes a protrusion;   compressing the heated material such that the heated material is molded into the object frame to conform to pre-defined dimensions, the object frame further including a recess with recess dimensions that conform to an error tolerance;   cooling the object frame;   releasing the object frame from the mold via an ejection pin contacting the recess; and   affixing an electronic component to the recess, covering a location of where the ejection pin contacted the recess.   
     
     
         2 . The method of  claim 1 , wherein the recess is created by the protrusion when the heated material is compressed. 
     
     
         3 . The method of  claim 1 , wherein the recess includes a first recess surface with a first depth of 0.19-0.23 mm. 
     
     
         4 . The method of  claim 3 , wherein the recess includes a second recess surface with a second depth of 0.60-0.64 mm. 
     
     
         5 . The method of  claim 4 , wherein the first depth and the second depth conform to the error tolerance, wherein the error tolerance has a variance of +/−0.02 mm. 
     
     
         6 . The method of  claim 1 , wherein the recess dimensions of the recess are configured to accommodate the electronic component. 
     
     
         7 . The method of  claim 1 , wherein a through hole for receiving the ejection pin is disposed in the second plate at a location corresponding to the protrusion. 
     
     
         8 . The method of  claim 1 , wherein forming the object frame does not involve milling. 
     
     
         9 . The method of  claim 1 , wherein the heated material is composed of plastic and/or a polymer. 
     
     
         10 . The method of  claim 1 , the first plate and the second plate are composed of aluminum or steel. 
     
     
         11 . A mold apparatus for manufacturing an object, the mold apparatus comprising:
 a mold, wherein the mold comprises a first plate joinable to a second plate to form a cavity therebetween;   the cavity in the mold for receiving heated material to be molded into an object frame, the object frame including a first surface, a second surface opposing the first surface, a recessed portion within the second surface and having a single step, the single step being recessed from the second surface and having a surface area, and the recessed portion being configured to receive an electrical component;   a protrusion structure configured to form the recessed portion to dimensions that conform to an error tolerance; and   a through hole, formed in the second plate, passing through the protrusion structure and disposed in the mold for receiving a release pin configured to release the object frame from the mold, the through hole being located at a location corresponding to an interior of the recessed portion, the through hole having a cross-sectional area smaller than the surface area of the single step.   
     
     
         12 . The mold apparatus of  claim 11 , wherein the protrusion structure includes a protrusion portion protruding a distance. 
     
     
         13 . The mold apparatus of  claim 12 , wherein the protrusion portion defines the single step in the recessed portion. 
     
     
         14 . The mold apparatus of  claim 12 , wherein the protrusion portion defines a third surface in the recessed portion. 
     
     
         15 . The mold apparatus of  claim 12 , wherein the protrusion portion defines a fourth surface, a fifth surface, and a sixth surface in the recessed portion. 
     
     
         16 . The mold apparatus of  claim 12 , wherein the protrusion portion defines a shape and a dimension corresponding to a second shape and a second dimension of an electronic component. 
     
     
         17 . The mold apparatus of  claim 12 , wherein the distance is 0.19-0.23 mm. 
     
     
         18 . The mold apparatus of  claim 11 , wherein the heated material is a thermoplastic or a thermosetting polymer. 
     
     
         19 . The mold apparatus of  claim 11 , wherein the mold is constructed of at least one of steel or aluminum. 
     
     
         20 . The mold apparatus of  claim 11 , wherein the cavity is formed by an interior surface of the mold, the interior surface comprising:
 a first interior surface;   a second interior surface; and   a gate opening at a second location corresponding to one of the first interior surface or the second interior surface.