Film formation device, vapor-deposited film formation method, and organic el display device production method

Abstract

A film formation device according to an embodiment is provided with: a substrate holder for holding a substrate in an upright position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor-deposited film is to be formed; and an evaporation source for spraying a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The film formation device according to an embodiment is further provided with an adjustment means for reducing a variation in the thickness of a vapor-deposited film on the vapor deposition surface, which results from the inclination of the substrate.

1 . A film forming apparatus comprising:
 a substrate holder to hold a substrate in a standing position relative to a horizontal surface, the substrate comprising a surface to be vapor deposited, the surface being a surface on which a vapor deposition layer is formed; and   an evaporation source to supply a vapor deposition material toward the surface to be vapor deposited while carrying out a relative movement in at least either one of upward and downward orientations relative to the substrate holder, the evaporation source being provided in a region toward which the surface to be vapor deposited of the substrate being held by the substrate holder is to be oriented,   wherein the substrate holder is configured to hold the substrate with an inclination relative to a vertical surface such that an upper end of the substrate is brought to be farther away from the evaporation source,   wherein the film forming apparatus further comprises an adjusting instrument to decrease a variation in a thickness of the vapor deposition layer on the surface to be vapor deposited, the variation being based on the inclination of the substrate, and   wherein the adjusting instrument is configured to operate based on a relative height of the evaporation source with respect to the substrate holder.   
     
     
         2 . The film forming apparatus according to  claim 1 , wherein the adjusting instrument is configured to decrease the variation in the thickness of the vapor deposition layer by compensating based on the relative height for a difference in vapor deposition efficiency within the surface to be vapor deposited, the difference in vapor deposition efficiency being based on the inclination of the substrate. 
     
     
         3 . The film forming apparatus according to  claim 1 , wherein the relative height is obtained based on an output of a position sensor being installed in the evaporation source. 
     
     
         4 . The film forming apparatus according to  claim 1 ,
 wherein the evaporation source comprises three supplying units being stacked,   wherein each of the three supplying units comprises a nozzle being opened so as to be oriented toward the substrate, and   wherein a diameter of the nozzle provided to a supplying unit being positioned in a middle layer among the three supplying units is smaller than a diameter of the nozzle provided to a supplying unit being positioned in a lower layer among the three supplying units and is smaller than a diameter of the nozzle provided to a supplying unit being positioned in an upper layer among the three supplying units.   
     
     
         5 . A method of forming a vapor deposition layer, comprising:
 arranging in a vapor deposition apparatus, a substrate in a standing position relative to a horizontal surface, the substrate comprising a surface to be vapor deposited, the surface being a surface on which a vapor deposition layer is formed; and   depositing a vapor deposition material onto the surface to be vapor deposited by supplying the vapor deposition material from an evaporation source being provided in a region toward which the surface to be vapor deposited of the substrate is oriented, while causing the evaporation source to carry out a relative movement in at least either one of upward and downward orientations relative to the substrate,   wherein at the time of supplying the vapor deposition material, the substrate is held with an inclination relative to a vertical surface such that an upper end of the substrate is brought to be farther away from the evaporation source, and   wherein the vapor deposition material is deposited while a variation in a thickness of the vapor deposition layer is decreased by compensating, based on a relative height of the evaporation source with respect to the substrate, for a difference in vapor deposition efficiency within the surface to be vapor deposited, the difference in vapor deposition efficiency being based on the inclination of the substrate.   
     
     
         6 . The method of forming the vapor deposition layer according to  claim 5 , wherein the relative height is obtained based on an output of a position sensor being installed in the evaporation source. 
     
     
         7 . A method of manufacturing an organic electro-luminance (EL) display apparatus, comprising:
 forming at least a TFT and a first electrode on a supporting substrate;   vapor depositing an organic material above the supporting substrate using the method of forming the vapor deposition layer according to  claim 5 , and thereby forming an organic deposition layer; and   forming a second electrode on the organic deposition layer.