Method and polishing apparatus for machining a plate-shaped component, and plate-shaped component, in particular electrostatic holding apparatus or immersion wafer panel

Abstract

A method for machining a plate-shaped component, in particular an electrostatic holding device or an immersion wafer table, with a surface formed by end faces of protruding burls, including: mutual alignment of the component on a component carrier device and of a mechanical polishing tool on a tool carrier device, wherein the polishing tool and the component are arranged for relative movement to remove material from end face(s) of at least one burl. The polishing tool includes shape-stable, deformable binding agent and polishing particles therein. Pressure force between the polishing tool and the at least one burl is measured by a force sensor device. The tool carrier device and/or the component carrier device are set to a predefined working value of the pressure force such that material is removed from the end face during removal movement. Also disclosed are a plate-shaped component produced with the method, and a polishing device.

What is claimed is: 
     
         1 . A method for machining a plate-shaped component, wherein the component has a plane surface formed by end faces of a plurality of protruding burls, with the steps:
 mutual alignment of the component arranged on a component carrier device and of a mechanical polishing tool arranged on a tool carrier device, wherein the mechanical polishing tool and the component are arranged so as to be movable relative to each other, and   removal movement of the mechanical polishing tool and the component relative to each other such that with a plurality of partial movements, material is removed from an end face of at least one of the burls, wherein   the mechanical polishing tool has a composition comprising a shape-stable, deformable binding agent and polishing particles embedded in the binding agent,   a force sensor device is provided which can measure a pressure force acting between the mechanical polishing tool and the at least one burl, and   at least one of the tool carrier device and the component carrier device is set to a predefined working value of the pressure force between the mechanical polishing tool and the at least one burl, wherein the predefined working value of the pressure force is selected such that during the removal movement, material is removed from the end face of the at least one burl.   
     
     
         2 . The method according to  claim 1 , wherein
 the partial movements comprise translational movements of the mechanical polishing tool relative to the at least one burl.   
     
     
         3 . The method according to  claim 1 , wherein
 the partial movements along the plane surface of the component have movement directions of the mechanical polishing tool relative to the at least one burl which change step by step.   
     
     
         4 . The method according to  claim 3 , wherein
 the directions of successive partial movements of the mechanical polishing tool relative to the at least one burl differ by a non-integral part of 360°.   
     
     
         5 . The method according to  claim 4 , wherein
 the directions of successive partial movements of the mechanical polishing tool relative to the at least one burl differ in a range from 5° to 30°.   
     
     
         6 . The method according to  claim 1 , wherein
 the pressure force is measured by the force sensor device before starting the movement of the mechanical polishing tool and component relative to each other.   
     
     
         7 . The method according to  claim 1 , wherein
 the pressure force is measured by the force sensor device in predefined measuring phases in which the mechanical polishing tool is at rest following a plurality of partial movements on the at least one burl.   
     
     
         8 . The method according to  claim 1 , wherein
 the mechanical polishing tool acts on the at least one burl without a lapping agent.   
     
     
         9 . The method according to  claim 1 , wherein
 the binding agent comprises a plastic and the polishing particles are comprised of diamond.   
     
     
         10 . The method according to  claim 1 , wherein
 the binding agent has a stiffness in a range from 5 N/mm to 30 N/mm.   
     
     
         11 . The method according to  claim 1 , with the further step
 setting a machining region within the surface of the component, to which the movement of the mechanical polishing tool and the component relative to each other is restricted.   
     
     
         12 . The method according to  claim 1 , wherein
 the plate-shaped component comprises an electrostatic holding device.   
     
     
         13 . The method according to  claim 1 , wherein
 the plate-shaped component comprises an immersion wafer table.   
     
     
         14 . A plate-shaped component, comprising
 a base plate, and   a plurality of protruding burls which are arranged on the base plate and end faces of which form a plane surface of the component, wherein   an end face of at least one of the burls has a roughness in a form of polishing or lapping marks which run laterally and parallel to the surface of the component.   
     
     
         15 . The plate-shaped component according to  claim 14 , comprising an electrostatic holding device. 
     
     
         16 . The plate-shaped component according to  claim 14 , comprising an immersion wafer table. 
     
     
         17 . A polishing device for machining a plate-shaped component, wherein the plate-shaped component has a plane surface formed by end faces of a plurality of protruding burls, comprising:
 a component carrier device configured to receive the plate-shaped component,   a tool carrier device configured to receive a mechanical polishing tool, wherein the mechanical polishing tool and the plate-shaped component can be moved relative to each other by at least one of the tool carrier device and the component carrier device, and   a drive device which acts on the at least one of the tool carrier device and the component carrier device and is configured for a removal movement of the mechanical polishing tool and the plate-shaped component relative to each other, such that with a plurality of partial movements, material is removed from an end face of at least one of the burls, wherein   the mechanical polishing tool comprises a shape-stable, deformable binding agent and polishing particles embedded in the binding agent,   the tool carrier device comprises a force sensor device which can measure a pressure force acting between the mechanical polishing tool and the at least one burl, and   a control device is provided with which at least one of the tool carrier device and the component carrier device can be adjusted to a predefined working value of the pressure force between the mechanical polishing tool and the at least one burl.   
     
     
         18 . The polishing device according to  claim 17 , wherein
 the tool carrier device comprises a tool portal.   
     
     
         19 . The polishing device according to  claim 17 , wherein
 the polishing device is configured for machining an electrostatic holding device.   
     
     
         20 . The polishing device according to  claim 17 , wherein
 the polishing device is configured for machining an immersion wafer table.