Enclosed cavity structures

Abstract

An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

1 - 70 . (canceled) 
     
     
         71 . A cavity structure, comprising:
 a cavity substrate comprising a substrate surface;   a component support disposed on the substrate surface, wherein the cavity substrate and component support form at least a portion of an enclosing volume; and   a component physically attached to the component support and suspended within the at least a portion of an enclosing volume.   
     
     
         72 . The cavity structure of  claim 71 , comprising a cavity extending into the cavity substrate in a direction away from the substrate surface, the cavity forming a portion of the enclosing volume. 
     
     
         73 . The cavity structure of  claim 71 , wherein the component support is non-native to the cavity substrate. 
     
     
         74 . The cavity structure of  claim 71 , comprising a cap disposed over the cavity substrate, the cap forming a portion of the enclosing volume. 
     
     
         75 . The cavity structure of  claim 74 , wherein the cap is adhered to the cavity substrate. 
     
     
         76 . The cavity structure of  claim 74 , wherein the cap is adhered to the component support. 
     
     
         77 . The cavity structure of  claim 71 , wherein the component support surrounds the component in a direction parallel to the substrate surface. 
     
     
         78 . The cavity structure of  claim 71 , comprising a structure tether physically attached to and extending from the component support. 
     
     
         79 . The cavity structure of  claim 78 , wherein the structure tether is physically attached to and extends from the component support outside the enclosing volume. 
     
     
         80 . The cavity structure of  claim 71 , wherein the component support has a height over the cavity substrate and the component has a thickness substantially equal to the height. 
     
     
         81 . The cavity structure of  claim 71 , wherein the component is attached to the component support in two locations symmetrically arranged on either side of the component. 
     
     
         82 . The cavity structure of  claim 71 , comprising a structure tether physically attached to and extending from the cavity substrate. 
     
     
         83 . The cavity structure of  claim 71 , wherein the cavity substrate is disposed on a destination substrate. 
     
     
         84 . The cavity structure of  claim 71 , the component support and the component have been printed to the cavity substrate. 
     
     
         85 . The cavity structure of  claim 71 , wherein the component is fully enclosed in the enclosing volume. 
     
     
         86 . A cavity source wafer, comprising:
 a source wafer comprising a sacrificial layer having sacrificial portions spaced apart by anchors; and   a plurality of cavity structures according to  claim 71 , each of the cavity structures disposed entirely and directly over a corresponding one of the sacrificial portions.   
     
     
         87 . A component source wafer, comprising:
 a source wafer comprising a sacrificial layer having sacrificial portions spaced apart by anchors;   a plurality of component supports each disposed directly and entirely over a corresponding one of the sacrificial portions; and   a component physically attached to each of the component supports.   
     
     
         88 . A method of making a component structure, comprising:
 providing a component source wafer comprising a sacrificial layer having sacrificial portions spaced apart by anchors; and   forming (i) component supports disposed directly and entirely over corresponding sacrificial portions on the component source wafer and (ii) a component physically attached to each of the component supports in order to form component structures comprising the component supports and the components.   
     
     
         89 . The method of  claim 88 , comprising providing cavity substrates and transfer printing the component structures to the cavity substrates. 
     
     
         90 . The method of  claim 89 , comprising forming cavities in the cavity substrates before transfer printing the component structures to the cavity substrates, and then transfer printing the component structures to the cavity substrates over the cavities. 
     
     
         91 . The method of  claim 88 , comprising transfer printing caps over the component structures. 
     
     
         92 . The method of  claim 88 , comprising providing a destination substrate and transfer printing the component structures to the destination substrate.