US2021242405A1PendingUtilityA1
Method of quality determining of deposition mask, method of manufacturing deposition mask, method of manufacturing deposition mask device, method of selecting deposition mask and deposition mask
Est. expiryJul 9, 2038(~11.9 yrs left)· nominal 20-yr term from priority
Inventors:Chikao Ikenaga
H10K 71/166C23C 14/042C23C 16/042C23C 14/12G06T 2207/30108G06T 7/0006C23C 14/24G01N 2021/8874G03F 7/0015G01N 2021/95676H01L 51/001H01L 51/56H01L 51/0011H10K 71/164
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Claims
Abstract
A method of quality determination of a deposition mask according to the present disclosure includes: a measuring step that measures a dimension X1 from a P1 point to a Q1 point, and a dimension X2 from a P2 point to a Q2 point; and a determining step that determines a quality of a deposition mask, based on the dimension X1 and the dimension X2 measured in the measuring step.
Claims
exact text as granted — not AI-modified1 . A method of quality determination of a deposition mask for determining a quality of a deposition mask extending in a first direction, the deposition mask comprising: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; the method comprising:
a measuring step that measures a dimension X 1 from the P 1 point to the Q 1 point, and a dimension X 2 from the P 2 point to the Q 2 point; and
a determining step that determines a quality of the deposition mask, based on the dimension X 1 and the dimension X 2 measured in the measuring step.
2 . The method of quality determination of a deposition mask according to claim 1 , wherein
the determining step determines whether an equation below is satisfied:
α
X
-
X
1
+
X
2
2
≤
α
X
15
×
10
-
3
_
in which α X represents a design value of the dimension X 1 and the dimension X 2 .
3 . The method of quality determination of a deposition mask according to claim 1 , wherein:
the deposition mask has a plurality of through holes; and the determining step determines whether an equation below is satisfied:
X
1
-
X
2
≤
α
X
10
×
α
Y
W
Y
×
10
-
3
_
in which α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of the two through holes in the second direction.
4 . The method of quality determination of a deposition mask according to claim 1 , wherein
the P 1 point and the P 2 point are intended to be symmetrically arranged with respect to the first center axis line during deposition, and the Q 1 point and the Q 2 point are intended to be symmetrically arranged with respect to the first center axis line during deposition.
5 . The method of quality determination of a deposition mask according to claim 1 , wherein:
the P 1 point and the P 2 point are arranged on one side of a second center axis line arranged at a center position of the first direction; and the Q 1 point and the Q 2 point are arranged on the other side of the second center axis line.
6 . The method of quality determination of a deposition mask according to claim 5 , wherein
the P 1 point and the Q 1 point are intended to be symmetrically arranged with respect to the second center axis line during deposition, and the P 2 point and the Q 2 point are intended to be symmetrically arranged with respect to the second center axis line during deposition.
7 . A method of manufacturing a deposition mask comprising:
a step of preparing a deposition mask; and a step of determining a quality of the deposition mask by the method of quality determination of a deposition mask according to claim 1 .
8 . A method of manufacturing a deposition mask extending in a first direction, the method comprising:
a step of supplying an elongated metal plate extending in a strip shape; a step of etching the metal plate by a photolithographic technique to form a first recess in the metal plate from a first surface side; and a step of etching the metal plate by the photolithography technique to form a second recess in the metal plate from the second surface-side, the deposition mask comprises: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; wherein the deposition mask satisfies an equation below:
α
X
-
X
1
+
X
2
2
≤
α
X
15
×
10
-
3
_
in which X 1 represents a dimension from the P 1 point to the Q 1 point, X 2 represents a dimension from the P 2 point to the Q 2 point, and α X represents a design value of the dimension X 1 and the dimension X 2 .
9 . The method of manufacturing a deposition mask according to claim 8 , wherein:
the deposition mask has a plurality of through holes formed by communicating the first recess and the second recess with each other; and wherein the deposition mask satisfies an equation below:
X
1
-
X
2
≤
α
X
10
×
α
Y
W
Y
×
10
-
3
_
in which α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of the two through holes in the second direction.
10 . A method of manufacturing a deposition mask extending in a first direction, the method comprising:
a step of supplying an elongated metal plate extending in a strip shape; a step of etching the metal plate by a photolithographic technique to form a first recess in the metal plate from a first surface side; and a step of etching the metal plate by the photolithography technique to form a second recess in the metal plate from the second surface side, the deposition mask comprises: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; and a plurality of throughholes formed by communicating the first recess and the second recess with each other, wherein the deposition mask satisfies an equation below:
X
1
-
X
2
≤
α
X
10
×
α
Y
W
Y
×
10
-
3
_
in which X 1 represents a dimension from the P 1 point to the Q 1 point X 2 represents a dimension from the P 2 point to the Q 2 point α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction.
11 . A method of manufacturing a deposition mask device comprising:
a step of preparing the deposition mask by the method of manufacturing a deposition mask according to claim 7 ; and a step of applying a tensile force to the deposition mask in the first direction and stretching the deposition mask on a frame.
12 . A method of selecting a deposition mask extending in a first direction, the deposition mask comprising: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; the method comprising:
a measuring step that measures a dimension X 1 from the P 1 point to the Q 1 point, and a dimension X 2 from the P 2 point to the Q 2 point; and
a selecting step that selects the deposition mask wherein the dimension X 1 and the dimension X 2 measured in the measuring step satisfy an equation below:
α
X
-
X
1
+
X
2
2
≤
α
X
15
×
10
-
3
_
in which α X represents a design value of the dimension X 1 and the dimension X 2 .
13 . A method of selecting a deposition mask extending in a first direction and having a plurality of through holes, the deposition mask comprising: a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; the method comprising:
a measuring step that measures a dimension X 1 from the P 1 point to the Q 1 point, and a dimension X 2 from the P 2 point to the Q 2 point; and
a selecting step that selects the deposition mask wherein the dimension X 1 and the dimension X 2 measured in the measuring step satisfy an equation below:
X
1
-
X
2
≤
α
X
10
×
α
Y
W
Y
×
10
-
3
_
in which α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction.
14 . A deposition mask extending in a first direction, comprising:
a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; wherein the deposition mask satisfies an equation below:
α
X
-
X
1
+
X
2
2
≤
α
X
15
×
10
-
3
_
in which X 1 represents a dimension from the P 1 point to the Q 1 point, X 2 represents a dimension from the P 2 point to the Q 2 point, and α X represents a design value of the dimension X 1 and the dimension X 2 .
15 . A deposition mask extending in a first direction and having a plurality of through holes, comprising:
a first center axis line that extends in the first direction and is arranged at a center position of a second direction orthogonal to the first direction; a P 1 point and a Q 1 point that are provided on one side of the first center axis line and are spaced apart from each other along the first direction; and a P 2 point and a Q 2 point that are provided on the other side of the first center axis line and are spaced apart from each other along the first direction; wherein the deposition mask satisfies an equation below:
X
1
-
X
2
≤
α
X
10
×
α
Y
W
Y
×
10
-
3
_
in which X 1 represents a dimension from the P 1 point to the Q 1 point, X 2 represents a dimension from the P 2 point to the Q 2 point, α X represents a design value of the dimension X 1 and the dimension X 2 , α Y represents a design value of a dimension from the P 1 point to the P 2 point and a dimension from the Q 1 point to the Q 2 point, and W Y represents a maximum value of a distance between center points of two through holes in the second direction.Join the waitlist — get patent alerts
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